Study on the Preparation of a High-Efficiency Carbon Fiber Dissipating Coating

Abstract

The working temperature of electronic components directly determines their service life and stability. In order to ensure normal operation of electronic components, cooling the coating is one of the best ways to solve the problem. Based on an acrylic amino-resin system, a dissipating coating was prepared with carbon fiber (CF) as the main thermal conductive filler. The influence of the CF content on the thermal conductivity was determined by the single factor method. The surface structure was observed by scanning electron microscopy (SEM). The results show: With the increase of the CF mass fraction, both the heat dispersion and heat conduction coefficient of the coating tend to increase at first and then decrease, and the heat dissipation effect is optimum when the CF mass fraction is 12.3 wt %. At this point, the coating shows an excellent comprehensive performance, such as 1st level adhesion, H grade hardness, and thermal conductivity of 1.61 W/m•K. Furthermore, this paper explored the radiating mechanism of coating in which CF produces a coating which forms a heat "channel" for rapid heat conduction. When the optimal value is exceeded, the cooling effect is reduced because of the accumulation and the anisotropy of CF.

Monte Carlo simulations of electrical percolation in multicomponent thin films with nanofillers

“…It is commonly believed that 1D and 2D conductive nanofillers can form cosupporting networks in which the 1D nanofillers act as long distance charge transporters while the 2D nanofillers serve as interconnections between 1D nanofillers by forming local conductive paths [8,9]. Polymeric nanocomposites reinforced with carbon-based nanomaterials have been the subject of intense experimental and theoretical study [10][11][12][13][14][15]. As shown by the experimental results, the hybrid composites cannot only combine the advantages of different nanofillers but also improve materials properties through a synergistic effect.…”

Enhancement of thermal stability and wettability for epoxy/Cu coated carbon fiber composites

“…Metal-coated carbon fiber can be used for this purpose to improve wettability, to increase the lifetime of a part by increasing heat transport, to reduce hot spots and to reduce thermal stress by dispersing the heat [4].…”

Electrodeposition of Copper/Carbonous Nanomaterial Composite Coatings for Heat-Dissipation Materials

“…Heat management has recently become a major issue in the electronics industry because of the continuous miniaturization of devices. This miniaturization has led to increased power densities; thus, effective heat removal is important to maintain and improve their performance [1][2][3]. Copper or its alloys have been widely used in the electronics industry as heat-dissipation materials because of its excellent thermal conductivity [3][4][5].…”