Study on the mechanism of glass-SiC-glass anodic bonding process
Xiao Cheng,
Lifang Hu,
Wei Liu
et al.
Abstract:The connection of SiC to glass is important for the development of microelectromechanical systems. In the study, glass-SiC-glass with SiC as common anode was effectively bonded by using anodic bonding technology in atmosphere. The interfacial microstructure of bonded joints was analyzed by using SEM, EDS and TEM. The effect of the bonding voltage and bonding temperatures on the interfacial microstructure and mechanical property of glass/SiC/glass was investigated. The results indicated that a Na+ depletion la… Show more
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