Study on the interfacial interactions and adhesion behaviors of various polymer‐metal interfaces in nano molding

Abstract

This study focuses on investigating interfacial interactions and the adhesion mechanism of polymer‐metal interfaces in nano‐molding. Polyphenylene sulfide (PPS), polyamide 6 (PA6), and isotactic polypropylene (iPP) were chosen as candidate polymers, and aluminum (Al), and copper (Cu) were used as metal substrates. By establishing the metal matrix composed of a rectangular pit with length, width, and depth of 4.5, 4.5, and 2.0 nm, respectively, six paired polymer‐metal interfacial systems in a cuboid of 7.5 × 7.5 × 11.5 nm, consisting of metal, polymer, and vacuum layer (from bottom to top) were constructed. Molecular dynamics simulations were performed to calculate interfacial interactions and bonding processes. Results showed that wall‐slip behavior was pronounced in nano‐molding. Viscoelasticity and polarity of the polymers played a crucial role in interfacial interactions, which guided the wall‐slip behavior and greatly affected the bolt performance. PA6 and PPS were more suitable for molding than iPP on both Al and Cu substrates. PA6 showed the best filling and bonding performances, followed by PPS, while iPP revealed the poorest performances. The Cu substrate exhibited better anchor strength and filling rate than Al substrates with the same polymer.

Molecular dynamics simulation study of the joining strength of different polymer‐aluminum heterointerfaces in nano‐injection molding

“…The strength of the joining at the polymer-metal interface mainly depends on the non-bonding interaction, which can be characterized by the interfacial energy (nonbonding interaction energy). To directly judge the strength of the interaction between the polymer molecule and the aluminum substrate based on the numerical magnitude, the binding energy is defined as the negative value of the interaction energy between the polymer molecule and the metal substrate surface E interation ¼ ÀΔE ð Þ : In the nano-injection molding process, the van der Waals' non-bonding interaction energy and electrostatic interactions in the polymer-metal interface can be calculated by [18] ,…”

“…Mori and Matubayasi [16,17] reported that the molecular scale of the polymer and the size of the nano-cavity in the metal matrix impact the filling rate in nanoinjection molding. Liu et al [18] discovered that polymers of different polarities are related to the slippage of the nano-injection mold cavity wall. Additionally, the separation process of the polymer-metal interface should be noted.…”

Synthesis of waterborne acrylic copolymer resin as a binding agent for the development of water‐based inks in the printing application

“…The corona-treated PET film's surface group and the small surface energy difference between the PET films and developed ink may also help to anchor with each other. [23][24][25][26] 3.3.7 | Rub resistance study Rub resistance is a significant property of ink, which provides readability of text matter or any defect in printing design visibility. During the supply chain of packaging materials, they experience the rough and uneven conditions of the road.…”

Experimental investigation and molecular dynamics simulations of the effect of processing parameters on the filling quality of injection‐molded micropillars

“…Each nucleus is considered to move according to Newton's law under the action of the empirical potential field provided by other nucleus and electrons. Nowadays, the MD method has been widely used in injection molding to analyze the molding quality of molding parts, [ 18‐20 ] the demolding quality, [ 21 ] geometrical morphologies of parts, [ 22 ] and even filling behavior of array structures. [ 23 ] It is well known that the MD simulations are all in the nanoscale because the limited computational power and the experimental measurements are usually in the microscale for the requirements of test conditions and accuracy.…”