Study on the Influence of pH on MRR Based on Acidic Slurry in CMP of 304 Stainless Steel

Su, Jian Xiu; Yao, Jian Guo; Wang, Zhan Kui; Li, Jie; Fu, Su Fang

doi:10.4028/www.scientific.net/amr.1136.327

Cited by 2 publications

(2 citation statements)

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“…Polishing solution is one of the key factors of CMP, which directly affects the workpiece polishing quality and efficiency (Werrell et al , 2017). At present, the acidic and alkaline polishing solution are most used in engineering fields (Zhang et al , 2021; Su et al , 2016). For the requirement of comparative analysis, the oxalic acid, deionized water and triethanolamine were all selected and used in this study.…”

Section: Methodsmentioning

confidence: 99%

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Tian,

Wu,

Pang

et al. 2023

ILT

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Purpose This study aims to clarify the influence mechanism of polishing solution type on the glazing evolution of fixed abrasive pad under different interfacial pressure conditions. Design/methodology/approach The tribological experiments were carried out on the friction and wear machinery with W3-5 diamond fixed abrasive pad and quartz glass workpiece under three polishing solution types of five pressure conditions. The changes of surface morphology, porosity and hardness of fixed abrasive pad were detected by white light interferometer, optical microscope and shore hardness tester. Findings The results showed that the glazed phenomenon of fixed abrasive pad is occurred after a certain time, which is more obvious with the increasing of interfacial pressures. The polishing solution type has a significant effect on the glazing time, although the glazed phenomenon is inevitable. The mechanism of it is that the micro-convex peaks on the surface of the fixed abrasive pad are easily wear, and the pores are blocked by the accumulation of waste debris generated during the experiment process. Thus, a smooth and high-density hard layer is formed on the surface of the fixed abrasive pad which induces the decreasing of the friction coefficient and surface roughness value. For selected polishing solution types, the wear rate of micro-convex peaks is different due to the corrosion action difference with polishing pad surface. Originality/value The main contribution of this work is to provide a new investigating method for further understanding the glazing evolution mechanism of fixed abrasive pad. Peer review The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-08-2023-0257/

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Section: Methodsmentioning

confidence: 99%

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Tian,

Wu,

Pang

et al. 2023

ILT

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“…[12][13][14] In recent years, chemical mechanical polishing of stainless steel, particularly in the field of consumer electronics, such as cell phone frame, has been a hot topic. Su et al 15 studied the CMP of stainless steel using alumina abrasives and found the type of oxidants and pH of polishing fluid affected the MRR and polishing mechanism. Wang et al 16 investigated the effect of H 2 O 2 on the chemical-mechanical polishing properties of bearing steel and showed that the mass fraction of H 2 O 2 was relevant to the strength of the reaction layer formed on the surface.…”

mentioning

confidence: 99%

Two-Step Chemical Mechanical Polishing of Stainless Steel

Guo

et al. 2022

ECS J. Solid State Sci. Technol.

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Stainless steel with high surface quality is required in many industries and chemical mechanical polishing can achieve both local and global planarization of the substrate surface. However, it is difficult to realize both high material removal rate and high surface quality by a single step polishing. In this regard, a two-step polishing process, coarse polishing with α-Al2O3 abrasives first and then fine polishing with silica abrasives, was proposed to solve the trade-off between material removal and surface quality. The effects of pH (1~12) and H2O2 (0~0.5wt%) on the polishing of 304 stainless steel disk (area ~6.7 cm2) were systematically studied and CMP mechanism of stainless steel was discussed. The results indicated that, at pH 4, with the addition of 0.01wt% H2O2, the surface roughness of stainless steel was successfully reduced from 0.702 μm to 44.6 nm (the first step using α-Al2O3 abrasives) and 1.61 nm (the second step using silica abrasives). Finally, an ultra-smooth surface was obtained with decent material removal rate.

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Study on the Influence of pH on MRR Based on Acidic Slurry in CMP of 304 Stainless Steel

Cited by 2 publications

References 0 publications

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Two-Step Chemical Mechanical Polishing of Stainless Steel

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