Study on the galvanic corrosion of titanium and stainless steel couple with the synergistic effect of proton and fluoride ion

Yan, Zhou-Zhou; Zhang, Qinhao; Cai, Haoran; Li, Xinran; Wu, Lian-Kui; Luo, Zhuang-Zhu; Cao, Fahe

doi:10.1016/j.corsci.2022.110541

Cited by 15 publications

(4 citation statements)

References 52 publications

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“…Corrosion experiments for copper (active) and aluminum (passive) were conducted in the presence of two readily employed RMs: FcMeOH − and Ru(NH) 6 3+ . − The OCP of Cu (Figure a) exposed to a 0.6 M NaCl solution (blank) reached an average of −268 ± 3 mV vs SCE after 2 h. Next, Cu samples were exposed to solutions containing each RM, and their OCPs were monitored for another 1.5 h to observe any changes due to polarization from the RMs present. A shift of approximately 100 mV in the positive direction was observed for the sample exposed to Ru(NH) 6 3+ , with an apparent OCP of −158 ± 10 mV.…”

Section: Resultsmentioning

confidence: 99%

Effect of Redox Mediators on Corrosion Behavior and Scanning Electrochemical Microscopy Response

Mena-Morcillo,

Ebrahimzadeh Pilehrood,

Moshrefi

et al. 2024

Anal. Chem.

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Scanning electrochemical microscopy (SECM) is widely used to measure local electrochemical reactivity of corroding surfaces. A major criticism of using SECM in feedback mode for corrosion studies is the requirement of an external redox mediator (RM) as it could react with the metal and affect the Nernst potential at the metal–solution interface. Consequently, it becomes challenging to differentiate the interference caused by the RM from the local reactivity of the metal. Herein, a multiscale electrochemical approach is presented to investigate the effect of RM choice on the corroding substrate. Two common RMs, ferrocenemethanol and hexaammineruthenium(III) chloride, were used to perform SECM over copper and aluminum. It was found during macroscale electrochemical measurements that Ru(NH)6 3+ acted as an oxidant and promoted corrosion. The SECM feedback behavior varied for copper depending on the RM used, suggesting that the corrosion reactions controlled the negative feedback mechanism, not the formation of an insulating passive film. The passivated aluminum surface consistently exhibited negative feedback, regardless of the RM used. SECM approach curves also displayed a distortion in the steady state current, which was caused by the deposition of substrate-generated species on the microelectrode. These deviations in feedback response were accounted for during analysis through incorporation into a finite element model to accurately extract the RM kinetic rate constants. The importance of understanding these processes is highlighted to avoid misinterpretation of passive behavior and advances toward a more quantitative use of SECM for corrosion studies.

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Section: Resultsmentioning

confidence: 99%

Effect of Redox Mediators on Corrosion Behavior and Scanning Electrochemical Microscopy Response

Mena-Morcillo,

Ebrahimzadeh Pilehrood,

Moshrefi

et al. 2024

Anal. Chem.

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“…Galvanic corrosion is a common corrosion type caused by the contact of dissimilar metals, which could seriously damage offshore engineering equipment [1,2]. The damage degree of galvanic corrosion mainly relies upon the potential difference of dissimilar metals and the area ratio of anode and cathode [3,4].…”

Section: Introductionmentioning

confidence: 99%

“…Finally, the bidirectional coupling of mechanics and electrochemistry was achieved. The mass transfer process in the electrolyte follows the conservation of mass and charge, described by transient equation (1). Moreover, convection, diffusion, and electromigration should be taken into consideration in the mass transfer process [15].…”

Section: Introductionmentioning

confidence: 99%

Multi-physics simulation of mechano-electrochemical bidirectional coupling interaction of galvanic corrosion between Al alloy and 316L SS

Hou

Wang

Guo

et al. 2023

Modelling Simul. Mater. Sci. Eng.

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Due to the limitations of experimental testing in material size and time scale, this work presents a mechano-electrochemical bidirectional coupling FEM simulation model on account of mechanistic and corrosion kinetics understanding in Al alloy-316L SS galvanic couple. The galvanic corrosion behavior and anodic dissolution deformation of the couple in 3.5 wt.% NaCl solution were analyzed. The effect of external load on galvanic corrosion initiation and propagation was investigated based on Gutman's theory. The FEM model reveals that the galvanic corrosion is connected with the mechanical damage and the stress concentration coefficient, and highlights the crucial role of corrosion defect in the mechanical behavior of Al alloy. The results show that the external force aggravates the galvanic corrosion at the defects, deteriorating the protection of corrosion products. The thickness of the Al (OH)3 deposition layer reflects the electrochemical reactivity at different positions on the anode surface. The mechanical damage occurs initially at the corrosion defect and then extends to the middle of the anode. The stress concentration coefficient at the center of the anode gradually exceeds the position of the corrosion defect, resulting in mechanical failure at this position.

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“…On the other hand, ion-selective microelectrodes have also been employed as SECM tips in a potentiometric operation [35]. As result, SECM has gained increasing interest and application, especially ove past fifteen years, with significant achievements in the study of pitting initiation and p agation [17,18], galvanic pair formation [19][20][21], the resolution of surface microstruc [22][23][24], stress corrosion [25,26], and the investigation of electron transfer kinetics in sive oxide layers [27,28]. In addition, it is also used to establish the effectiveness of d ent corrosion protection schemes or technologies, including coatings [29][30][31] or su treatments [32][33][34].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Applicability of Voltammetric Modes in Scanning Electrochemical Microscopy for In Situ Corrosion Characterisation of Copper-Based Materials

Hernández-Concepción,

Méndez-Guerra,

Souto

et al. 2023

Metals

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Chemical imaging of corrosion processes involving copper species using scanning electrochemical microscopy has been hampered by the lack of soluble oxidation states for copper that can be achieved by amperometric conversion at the tip. Indeed, the only possibility is to reduce the corrosion products at the tip, thus modifying the chemical response of the electrode material and requiring subsequent redissolution of the copper deposits. Consequently, the limitations arising from the system prevented a full-scale quantification, requiring the development of new methodologies or the optimisation of those currently available, as we pursued with the present work. Therefore, the voltammetric behaviours of gold macro- and microelectrodes were evaluated with respect to the collection and redissolution of Cu2+ ions, with the aim of using them as sensing probes in scanning electrochemical microscopy (SECM) to investigate the activity of copper surfaces in acidic chloride-containing environments. Cyclic and square-wave voltammetric techniques were explored for copper collection and subsequent stripping on Au microelectrode tips in SECM with the objective to capture in situ image electrochemical reactivity distributions across copper surfaces undergoing corrosion.

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Study on the galvanic corrosion of titanium and stainless steel couple with the synergistic effect of proton and fluoride ion

Cited by 15 publications

References 52 publications

Effect of Redox Mediators on Corrosion Behavior and Scanning Electrochemical Microscopy Response

Effect of Redox Mediators on Corrosion Behavior and Scanning Electrochemical Microscopy Response

Multi-physics simulation of mechano-electrochemical bidirectional coupling interaction of galvanic corrosion between Al alloy and 316L SS

Evaluation of the Applicability of Voltammetric Modes in Scanning Electrochemical Microscopy for In Situ Corrosion Characterisation of Copper-Based Materials

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