Study on terahertz time-domain spectroscopy imaging method for bonding mass of fine ceramic components

Abstract

Terahertz has been rapidly developed and applied in the field of non-destructive testing because of its features such as perspective and safety. Ceramic devices have the advantages of high-temperature resistance and fatigue resistance and are now widely used in various fields. But at the same time, the ceramic device will have debonding defects due to process quality and environmental problems during the preparation process, which greatly reduces its performance. In this paper, terahertz time-domain spectroscopy is used to image defects in ceramics. Firstly, the optical parameters of ceramics are extracted by transmission terahertz time-domain spectroscopy, and then the defects of ceramics are imaged by maximum imaging, time-of-flight imaging, peak-to-peak imaging, and peak-to-peak time imaging. The defect image obtained by the imaging method is clearer. The type and size of defects can be further obtained by using the terahertz time-domain imaging method, which is an effective method to ensure the quality and safety of devices.