Study on surface modification of diamond particles and thermal conductivity properties of their reinforced metal-based (Cu or Mg) composites

Zhu, Congxu; Cui, Can; Wu, Xiaojuan; Zhang, Bowen; Yang, Dong; Zhao, Hongxiao; Zheng, Zhi

doi:10.1016/j.diamond.2020.107998

Cited by 18 publications

(8 citation statements)

References 31 publications

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“…The spectra were thus curve-tted into two components with a Gaussian line shape. The binding energy of 284.7 eV was attributed to the sp 2 carbon bands and the binding energy of 285.2 eV was attributed to the sp 3 carbon bands [17,21,22].…”

Section: Xps Analysis Of C Element On the Diamond Surfacementioning

confidence: 99%

Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools

Fang

Long

et al. 2022

Diamond and Related Materials

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Ordinary diamond presents the disadvantages of poor self-sharpening and concentrated grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be well wetted by the vitri ed bond, resulting in a lower holding force of the binder to the abrasives (i.e., the diamond is easy to detach from the binder matrix during grinding). These comprehensive factors not only reduce the surface quality of the processed workpiece, but also hinder the processing e ciency. In order to solve these problems, a new type of porous diamond with high self-sharpening properties was prepared using a thermochemical corrosion method in this study. Our results showed a great improvement in pore volume and speci c surface area of the porous diamond compared with ordinary diamond abrasive particles, and the holding force and wettability of vitri ed bond to the porous diamond abrasive particles were also improved.Compared with ordinary diamond abrasive tools, porous diamond abrasive tools showed a 29.6% increase in grinding e ciency, a 15.5% decreased in grinding ratio, a 27.5% reduction in workpiece surface roughness, and the scratches on the silicon wafer surface were reduced and re ned.

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Section: Xps Analysis Of C Element On the Diamond Surfacementioning

confidence: 99%

Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools

Fang

Long

et al. 2022

Diamond and Related Materials

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“…Sound interfacial bonding is the basic prerequisite for achieving a metal/diamond composite with high TC. In order to improve the thermal conductivity, diamond surface coating [9][10][11] and metal matrix alloying [12][13][14] have been applied to enhance the interfacial bonding between the diamond and the metal matrix. The surface coating method excels in improving composite performance; Kumar et al developed a series of zinc-based coatings such as Zn-WO 3 [15] and Zn-Ni-WC composite nanocoatings [16], which exhibit excellent corrosion resistance and high hardness, greatly expanding the application of steel in boat structures, manufacturing, nuclear power plants, etc.…”

Section: Introductionmentioning

confidence: 99%

“…Molina et al [7] coated Ti on the diamond surface and prepared Mg/diamond composites by gas pressure infiltration, thereby greatly improving the thermal conductivity of the composite. Zhu et al [11] used a molten salt method to successfully prepare surface-gradient-modified diamond particles. The value of the thermal conductivity of the surface-modified Mg/diamond composites with a diamond volume percentage of 35% reached 286 W/(m•K).…”

Section: Introductionmentioning

confidence: 99%

Effects of Chromium Carbide Coatings on Microstructure and Thermal Conductivity of Mg/Diamond Composites Prepared by Squeeze Casting

Ren

Ru³

et al. 2022

Materials

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Magnesium matrix composites are considered a desired solution for lightweight applications. As an attractive thermal management material, diamond particle-reinforced Mg matrix (Mg/diamond) composites generally exhibit thermal conductivities lower than expected. To exploit the potential of heat conduction, a combination of Cr coating on diamond particles and squeeze casting was used to prepare Mg/diamond (Cr) composites. The thickness of the Cr coating under different coating processes (950 °C/30 min, 950 °C/60 min, 950 °C/90 min, 1000 °C/30 min, and 1050 °C/30 min) was measured by FIB-SEM to be 1.09–2.95 μm. The thermal conductivity (TC) of the Mg/diamond composites firstly increased and then decreased, while the coefficient of thermal expansion (CTE) of Mg/diamond (Cr) composite firstly decreased and then increased with the increase in Cr coating thickness. The composite exhibited the maximum TC of 202.42 W/(m·K) with a 1.20 μm Cr coating layer, while a minimum CTE of 5.82 × 10−6/K was recorded with a coating thickness of 2.50 μm. The results clearly manifest the effect of Cr layer thickness on the TC and CTE of Mg/diamond composites.

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“…It was found that the mechanical properties of the composites gradually increased with the decrease in diamond particle size. Zhu [ 13 , 14 ] prepared chromium-coated diamond particles-reinforced copper matrix composite heat dissipation materials with excellent thermal physical properties by spark plasma sintering, which realized full chromium coating on the surface of diamond particles and good interface bonding with copper matrix metal materials. A new molten salt method was proposed to prepare surface-modified diamond particles by in situ reaction.…”

Section: Introductionmentioning

confidence: 99%

Study on the Microstructure and Mechanical Properties of Diamond Particle-Reinforced Copper-Iron Sandwich Composites Prepared by Powder Metallurgy

Sun

Jiang

et al. 2022

Materials

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Synthetic diamond particle-reinforced copper-iron composites (SD/Cu-Fe) were produced by the powder metallurgical method for stone cutting applications, and the microstructure, density, compactness, hardness, flexure strength, and wear resistance of the composites were characterized in this work. The results showed that the diamond particles were relatively uniformly distributed in most areas of the copper matrix and the crystal shape of diamond particles were relatively intact in the sintering temperature range from 740 °C to 780 °C. The interfaces between the diamond particles and copper matrix, as well as the interfaces between the copper matrix and iron layer, were well bonded without significant gaps. The physical properties of composites increased first and then decreased with the sintering temperature. When the sintering temperature was 770 °C, the related properties reached the best. Diamond played a key role in improving the properties of the SD/Cu-Fe sandwich composite. This work provides a basis for the research and development of high-performance diamond-reinforced copper-based iron sandwich composites.

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Study on surface modification of diamond particles and thermal conductivity properties of their reinforced metal-based (Cu or Mg) composites

Cited by 18 publications

References 31 publications

Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools

Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools

Effects of Chromium Carbide Coatings on Microstructure and Thermal Conductivity of Mg/Diamond Composites Prepared by Squeeze Casting

Study on the Microstructure and Mechanical Properties of Diamond Particle-Reinforced Copper-Iron Sandwich Composites Prepared by Powder Metallurgy

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