Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions

Hsiung, Ching-Kuo; Chang, Chin-Huang; Tzeng, Z.H.; Ho, Chun Sheng; Chien, Feng Lung

doi:10.1109/eptc.2007.4469686

Cited by 5 publications

(3 citation statements)

References 4 publications

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“…There are many synthesis routes for the fabrication of solders varying from solid state mechanical alloying, powder metallurgy, sol gel, melting and casting route, chemical routes, gaseous phase sputtering or evaporation methods, electrodeposition method, etc. [28][29][30][31][32][33][34][35]. Among all these methods, we will discuss techniques related to thin film pulse electrodeposition of solders.…”

Section: Synthesis Routes and Technologies For Solder Fabricationmentioning

confidence: 99%

Pulse Electroplating of Ultrafine Grained Tin Coating

Sharma¹,

Das²,

Das³

2015

Electroplating of Nanostructures

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In the electronic packaging industries, soldering materials are essential in joining various microelectronic networks. Solders assure the reliability of joints and protect the microelectronic packaging devices. They provide electrical, thermal, and mechanical continuity among various interconnections in an electronic device. The service performance of all the electronic appliances depends on high strength and durable soldering materials. Lead-containing solders are in use for years, resulting in an extensive database for the reliability of these materials. However, due to toxicity and legislations, lead-free solders are now being developed. As tin (Sn) is the major component of solders, this chapter presents the detailed results and discussion about the metallurgical overview of Sn, synthesis, and characterization of pulse electrodeposited pure tin finish from different aqueous solution baths. The experiments on pulse electrodeposition such as common tin plating baths employed, their chemical compositions, rationale behind their selection and their characterization by bath conductivity and cathodic current efficiency, microstructures, and tin whisker growth are discussed. Further, the effect of pulse electrodeposition parameters such as current density, additive concentration, pH, duty cycle, frequency, temperature, and stirring speed on microstructural characteristics of the coating obtained from sulfate bath and their effect on grain size distribution have been presented.

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Section: Synthesis Routes and Technologies For Solder Fabricationmentioning

confidence: 99%

Pulse Electroplating of Ultrafine Grained Tin Coating

Sharma¹,

Das²,

Das³

2015

Electroplating of Nanostructures

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“…Zinc doped tin oxide thin film semiconductor improves its mechanical properties, suitable for different technology applications. Doped tin oxide is used for solar cells [1], gas sensor [2], photo catalysis [3], pollutants detection [4], anode for ion lithium batteries [5] as quantum dots [6,7], ferromagnetic [8] and photoconductive devices. Nowadays, Zn doped SnO2 show promising applications for high temperature semiconductor [9] and optoelectronics devices [10], both properties are being improved by tuning the amount and type of dopants.…”

Section: Introductionmentioning

confidence: 99%

Zn dopant effect on growth, morphology, texture and mechanical properties of SnO2 thin films

Paraguay‐Delgado¹,

Hurtado-Macías²,

Solís-Canto³

2018

Superficies y Vacio

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When tin oxide thin film is doped with Zn, it grows textured and improves its mechanical properties. The material was synthesized on alkali-free borosilicate glass substrates by spray pyrolysis technique. The elemental composition was determined by X-ray energy dispersive spectroscopy and X-ray photoelectron spectroscopy. The morphology and microstructure of films were examined by electron microscopy techniques, they shown different shapes of crystalline particles according to the dopant content. From X-ray diffraction patterns processed by Rietveld refinement methodology was determine lattice parameters, crystallite sizes and micro strain; it showed that the textural growth of the films depend on the Zn dopant quantity content. The mechanical property was studied as a function of dopants amount, it enhancement due to the texture direction growth. For optimized Zn doped quantity in the film, local measurement of hardness and elastic modulus increased from 12 to 23 GPa and from 137 to 195 GPa, respectively. According to the Zn content, the materials show good correlation between elastic module values and (200) texture growth direction parallel to the substrate.

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“…[18,20] Various processing routes like melting and casting, powder metallurgy, high-energy ball milling/mechanical alloying, physical vapor deposition, sol-gel, plasma sprayed deposition, chemical methods, and electroplating have been employed to produce solder materials. [9][10][26][27][28][29][30][31] Powder metallurgy and mixing methods have been often used to fabricate the lead-free solders reinforced with nanoparticles: Cu, SiC, ZrO 2, Al 2 O 3 , SnO 2 , Y 2 O 3, TiB 2 , carbon nanotube (CNT), rare earth. [9, 21-22, 25, 32-36] There is also a limit on the amount of nanoreinforcement addition in the solder matrix; otherwise, it will deteriorate the solderability and strength.…”

Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions

Cited by 5 publications

References 4 publications

Pulse Electroplating of Ultrafine Grained Tin Coating

Pulse Electroplating of Ultrafine Grained Tin Coating

Zn dopant effect on growth, morphology, texture and mechanical properties of SnO2 thin films

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

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