Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

Deng, Yunhua; Qiao, Guifang; Wu, Bing; Wang, Xichang; Tao, Jun

doi:10.1016/j.matlet.2014.05.029

Cited by 6 publications

(3 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…At present, with EB as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of rigid restraint TSCB [19]. Sound solid-state joints with homogeneous microstructure and good comprehensive mechanical properties were obtained.…”

Section: Open Accessmentioning

confidence: 94%

“…Unlike be employed as a fusion heat source during fusion welding, the centralized heat source, such as electron beam (EB), laser beam (LB) or other types of heat source is employed as non-melted one to heat the rigid restrained specimens to be joined as shown in Figure 1. Under the locally non-melted heating, a thermal compressive effect is expected to be developed and a compressive pressure F will be produced synchronously, which facilitates the atom diffusion between butt-weld specimens to produce permanent solid-state joints [19].…”

Section: Open Accessmentioning

confidence: 99%

See 1 more Smart Citation

Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding

Deng

Qiao

Tao

et al. 2018

Chin. J. Mech. Eng.

Self Cite

View full text Add to dashboard Cite

Thermal self-compressing bonding (TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of TSCB. However, the thermal stress-strain process during bonding, which is of very important significance in revealing the mechanism of TSCB, was not analysed. In this paper, finite element analysis method is adopted to numerically study the thermal elasto-plastic stress-strain cycle of thermal self-compressing bonding. It is found that due to the localized heating, a non-uniform temperature distribution is formed during bonding, with the highest temperature existed on the bond interface. The expansion of high temperature materials adjacent to the bond interface are restrained by surrounding cool materials and rigid restraints, and thus an internal elasto-plastic stress-strain field is developed by itself which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints. Due to the relatively large plastic deformation, rigid restraint TSCB obtains sound joints in relatively short time compared to diffusion bonding.

show abstract

Section: Open Accessmentioning

confidence: 94%

Section: Open Accessmentioning

confidence: 99%

Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding

Deng

Qiao

Tao

et al. 2018

Chin. J. Mech. Eng.

Self Cite

View full text Add to dashboard Cite

show abstract

“…With increasing time of heat-treatment to 8 h (Figure 6c), the dimples became deeper and the number of dimples increased, which indicates better plasticity due to the high bonding ratio and migration of the GB along the bonding interface. The characterized morphology indicates that the fracture mechanism of the interface is ductile failure mode [30]. After holding for 12 h (Figure 6d), the dimples became larger and looser compared to after holding for 8 h, due to the increasing grain size.…”

Section: Tensile Propertiesmentioning

confidence: 97%

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

Ren

Chen

et al. 2021

Processes

View full text Add to dashboard Cite

In this study, a plastic deformation process consisting of hot compression at 350 °C and heat treatment at 400 °C was performed to bond AZ31 magnesium alloy. Microstructural evolution around the bonding interface was systematically characterized to investigate the bonding process and clarify the bonding mechanism. When the plastic deformation strain reached 0.6, the bonding zone was full of fine dynamic recrystallized grains and the initial interface was eliminated. The post-heating treatments were conducted to achieve a sound interface bonding. The tensile tests and the corresponding fracture morphologies analysis indicated that the optimum holding time of heat treatment was 8 h. The interfacial bonding strength of the specimens holding for 8 h reached 164.7 MPa, an enhancement of about 9% compared with that of the specimens holding for 1 h. The microstructure analysis indicated that the bonding quality was affected by migration of the interfacial grain boundary (GB), the development of recrystallized grains and the evolution of interfacial oxides around the bonding area.

show abstract

Rigid restraint thermal self-compressing bonding of pure titanium to titanium alloy

Deng

Qiao

2015

Materials Letters

View full text Add to dashboard Cite

Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

Cited by 6 publications

References 12 publications

Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding

Numerical Study on the Stress–Strain Cycle of Thermal Self-Compressing Bonding

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

Rigid restraint thermal self-compressing bonding of pure titanium to titanium alloy

Contact Info

Product

Resources

About