Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Shuibao Liang,
Han Jiang,
Jiaqiang Huang
Abstract:Cu-cored solder interconnects have been demonstrated to increase the performance of interconnect structures, while the quantitative understanding of the effect of the Cu-cored structure on microstructure evolution and atomic migration in solder interconnects is still limited. In this work, the effect of the Cu-cored structure on phase migration and segregation behavior of Sn-58Bi solder interconnects under electric current stressing is quantitatively studied using a developed phase field model. Severe phase se… Show more
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