Study on morphology reconstruction of SiC ceramics ground by monolayer-patterned grinding wheel considering strain rate effect

Abstract

For the purpose of optimizing grinding wheel profiles and grinding parameters, the prediction of the morphology of the grinding workpiece is essential. In this study, a new simulation model is developed to forecast the grinding workpiece surface morphology of ceramic material while accounting for the strain-rate effect. The effects of grinding parameters and patterned grinding wheel characteristics (e.g., grain geometry, grain size, grain protrusion height, and grain placement) on the surface and subsurface damage are explored.The results show that the simulation findings agree well with the theoretical approach, which takes the strainrate impact into account. Additionally, the magnitude of the change in surface roughness increases as the properties of the patterned grinding wheel grow, whereas the magnitude of the change in surface roughness reduces as the grinding parameters increase. Furthermore, the grinding parameters have a greater impact on subsurface damage than the patterned grinding wheel options.