Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints

Abstract

Transient liquid phase (TLP) bonding is a promising interconnection technology for high-temperature electronic packaging. In this paper, the effect of Cu particles on the microstructure and shear property of Cu/In-xCu/Cu TLP joints was investigated. The results show that Cu/In-xCu/Cu joint is mainly composed of an In and Cu 11 In 9 phase after bonded for 60 min. A small amount of Cu 2 In phase forms at the interface of Cu/Cu 11 In 9 with bonding time exceeding 300 min. The bonding efficiency and shear property of In-Cu mixed particle solder joint are superior to that of the In foil solder joint, because the bonding time was reduced and the shear strength of the solder joint was improved. The phase composition of Cu 11 In 9 and Cu 2 In in the joint increased, the porosity decreased and the shear strength increased with increasing Cu content. When the Cu content of the In-xCu solder was 45 wt.%, the shear strength of the Cu/In-45Cu/Cu joint reached the peak value of 15.7 MPa.

A Comparative Numerical Study of Thermo-Mechanical Behavior among Various IMC Joints under Thermal Cycling Condition

“…As a result, the reaction layer composed joints produced by TLP bonding can serve as die attachments for high-temperature working conditions. For WBG power modules, numerous IMC joints have been produced, and the typical category includes Ni 3 Sn 4 , Ag 3 Sn, Cu 6 Sn 5 , Cu 3 Sn, Ag 9 In 4 , and Ag 3 In [8][9][10][11][12] . Their suitability for die attachments has primarily been evaluated through shear tests, aging tests, and thermal cycling tests 11), [13][14][15] .…”

Thermomechanical Properties of Zeta (Ag3In) Phase

“…TLP bonding offers advantages such as facile processing and cost-effectiveness and has attracted considerable attention and extensive research in recent years. Numerous material combinations have been explored for TLP bonding, including the use of Sn, solder, In, and Ga as the molten layers and Cu, Ag, Ni, and Au as substrates [9][10][11][12][13][14][15][16]. Among these, the Ag-In combination has shown promising potential for TLP bonding.…”

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

“…Traditional high lead solders are not suitable and needed to be replaced. Although nano-particles sintering (Ag or Cu) can obtain high temperature resistant joints, high porosity, poor electrical and thermal conductivity and Ag migration remain to be resolved (Liu et al, 2021;Tuo et al, 2021). Recently, transient liquid phase sintering (TLPS) has been developed for power electronic package for the advantages of low bonding temperature and pressure, excellent high temperature resistance and high yield strength (Kejanli et al, 2009;Lee et al, 2015;Min et al, 2020).…”