Study on mechanical and electrical properties of the copolymer of bismaleimide and hyperbranched polyimide

Wang, Qingye; Shi, Jiahao; Zhang, Xiaorui; Wang, Xuan; Weng, Ling; Yu, Lida; Li, Chenhao; Cai, Haihui; Huiyong, Jin; Zhou, Yang

doi:10.1007/s10854-022-09243-0

Cited by 5 publications

(2 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As described above, the synthesis of polyimides (PIs) oen employs organic solvents such as m-cresol, 29 1-methyl-2pyrrolidone (NMP), [30][31][32] N,N-dimethylformamide (DMF), 33 N,Ndimethylacetamide (DMAc) 34,35 and isoquinoline. 36 The use of these organic solvents is environmentally unfriendly and does not align with the objectives of green and sustainable development.…”

Section: Introductionmentioning

confidence: 99%

Green synthesis of polyimide by using an ethanol solvothermal method for aqueous zinc batteries

Zhao,

Yang,

Zhong

et al. 2024

RSC Adv.

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

Green synthesis of polyimide by using an ethanol solvothermal method for aqueous zinc batteries

Zhao,

Yang,

Zhong

et al. 2024

RSC Adv.

View full text Add to dashboard Cite

show abstract

“…Besides, much more attention has been given to modifying the chemical structure of the polymer backbone. Yang et al [17] designed a novel hyperbranched PI (HBPI) that increased the free volume of the system, resulting in a significant improvement in the toughness of the modified resin. However, the design and synthesis of monomer structures are often complex and time-consuming, which greatly limits the efficiency of PI film preparation.…”

Section: Introductionmentioning

confidence: 99%

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

Zhao

Dong

et al. 2023

Polymers

View full text Add to dashboard Cite

High-quality and free-standing polyimide (PI) film with desirable mechanical properties and uniformity is in high demand due to its widespread applications in highly precise flexible and chip-integrated sensors. In this study, a free-standing PI film with high toughness was successfully prepared using a diamine monomer with ether linkages. The prepared PI films exhibited significantly superior mechanical properties compared to PI films of the same molecular structure, which can be attributed to the systematic exploration of the film-forming process. The exploration of the film-forming process includes the curing procedures, film-forming substrates, and annealing treatments. Additionally, the thickness uniformity and surface homogeneity of free-standing films were crucial for toughness. Increasing the crystallinity of the PI films by eliminating residual stress also contributed to their high strength. The results demonstrate that by adjusting the above-mentioned factors, the prepared PI films possess excellent mechanical properties, with tensile strength and elongation at break of 194.71 MPa and 130.13%, respectively.

show abstract

Core–shell structure BST@HBPI nanoparticle/polyetherimide nanocomposite with excellent compatibility, thermal stability and dielectric properties

Xia

Lin

Qian

et al. 2023

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Study on mechanical and electrical properties of the copolymer of bismaleimide and hyperbranched polyimide

Cited by 5 publications

References 41 publications

Green synthesis of polyimide by using an ethanol solvothermal method for aqueous zinc batteries

Green synthesis of polyimide by using an ethanol solvothermal method for aqueous zinc batteries

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

Core–shell structure BST@HBPI nanoparticle/polyetherimide nanocomposite with excellent compatibility, thermal stability and dielectric properties

Contact Info

Product

Resources

About