Study on localized induction heating for wafer level packaging

Abstract

Micro-electro-mechanical systems (MEMS) are being developed as a new multi-disciplinary technology, which will undoubtedly have a revolutionary impact on the future of human life. However, with the development of MEMS technology, the packaging has become the main technical obstacle to the commercialization of MEMS. An approach to MEMS packaging by high-frequency electromagnetic induction heating at wafer level is presented in terms of numerical simulation and experimental study. The structure of inductor is firstly designed and optimized. Then the heating situation of PCB board is verified. The results indicate that the heat impact on the chip during the packaging process can be effectively reduced by local induction heating packaging, therefore the thermal stress on the chip is considerably lowered. This method can effectively improve the reliability of the MEMS devices. MEMS packaging, numerical simulation, induction heating, structural optimization Citation:Xi Y Y, Luo X B, Liu W M, et al. Study on localized induction heating for wafer level packaging.