Study on grinding force modelling and ductile regime propelling technology in micro drill-grinding of hard-brittle materials

Cheng, Jun; Yin, Guoqiang; Wen, Quan; Shu, Hua; Gong, Yadong

doi:10.1016/j.jmatprotec.2015.04.005

Cited by 37 publications

(13 citation statements)

References 29 publications

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“…The diameter was approximately 0.003 mm. However, it is still difficult to fabricate spindle tools with diameters less than 0.1 mm by using the grinding process, due to the mechanical grinding force [17]. It is possible to produce small spindle tools with a high precision grinding machine, however, the aspect ratio is only 3 or 4 with diameters less than 0.1 mm.…”

Section: Wedg Technology Unitmentioning

confidence: 99%

Desktop Micro-EDM System for High-Aspect Ratio Micro-Hole Drilling in Tungsten Cemented Carbide by Cut-Side Micro-Tool

Huang

Sheu

2020

Micromachines

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Tungsten cemented carbide (WC-Co) is a widely applied material in micro-hole drilling, such as in suction nozzles, injection nozzles, and wire drawing dies, owing to its high wear resistance and hardness. Since the development of wire-electro-discharge grinding (WEDG) technology, the micro-electrical discharge machining (micro-EDM) has been excellent in the process of fabricating micro-holes in WC-Co material. Even though high-quality micro-holes can be drilled by micro-EDM, it is still limited in large-scale production, due to the electrode tool wear caused during the process. In addition, the high cost of precision micro-EDM is also a limitation for WC-Co micro-hole drilling. This study aimed to develop a low-cost desktop micro-EDM system for fabricating micro-holes in tungsten cemented carbide materials. Taking advantage of commercial micro tools in a desktop micro-EDM system, it is possible to reach half the amount of large-scale production of micro-holes. Meanwhile, it is difficult to drill the deep and high aspect ratio micro-holes using conventional micro-EDM, therefore, a cut-side micro-tool shaped for micro-EDM system drilling was exploited in this study. The results show that micro-holes with a diameter of 0.07 mm and thickness of 1.0 mm could be drilled completely by cut-side micro-tools. The roundness of the holes were approximately 0.001 mm and the aspect ratio was close to 15.

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Section: Wedg Technology Unitmentioning

confidence: 99%

Desktop Micro-EDM System for High-Aspect Ratio Micro-Hole Drilling in Tungsten Cemented Carbide by Cut-Side Micro-Tool

Huang

Sheu

2020

Micromachines

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“…According to the grinding mechanism, these issues are mainly attributed to the large normal grinding force and the small tangential grinding force in the grinding process. 4–8 The ratio of normal grinding force to tangential grinding force is approximately three (i.e. frictional coefficient is ∼1/3) in the conventional grinding.…”

Section: Introductionmentioning

confidence: 99%

A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Tian

Fan

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part B:

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In this work, a novel grinding method using a special abrasive tool was first proposed to achieve high tangential grinding force and low normal grinding force. The abrasive tool was developed with flexible composites to remove workpiece materials under “high-shear and low-pressure” grinding mode. The concept of the high-shear and low-pressure grinding method was introduced in detail. Grinding tests were carried out on a precision grinder with the developed abrasive tool for single crystal silicon specimens. The results showed that the grinding force ratio between tangential force and normal force for the proposed grinding method was ranged between 0.9 and 1.3, which was three times larger than that of the conventional grinding method. It was verified that the developed abrasive tool possessed the grinding characteristics of high tangential grinding force and low normal grinding force. After grinding of silicon specimens for 120 min, the value of surface roughness decreased from 429.20 to 32.91 nm under the selected grinding conditions. The surface quality of the silicon specimens was greatly improved after grinding.

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“…It is a typical difficult-to-machine material. According to the statistics, in the process of machining, the time of manufacturing hole accounts for 30-50% [2]. Although there are many methods to manufacture micro-holes, such as laser beam, electron beam, ion beam and EDM, the most widely used and most practical at home and abroad is still micro-drilling.…”

Section: Introductionmentioning

confidence: 99%

Study on hole quality and surface quality of micro-drilling nickel-based single-crystal superalloy

Zhou

et al. 2020

J Braz. Soc. Mech. Sci. Eng.

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Nickel-based single-crystal superalloy has no grain boundary. This makes the traditional cutting mechanism of shearing and slipping along grain boundary of polycrystalline material based on the theory of elastic-plastic deformation not suitable for drilling single-crystal parts. To achieve high-quality and low-damage micro-drilling of nickel-based single-crystal superalloy, the micro-drilling surface/subsurface quality of the (001) crystal plane of nickel-based single-crystal superalloy was studied in this paper. Firstly, the influence rules of the cutting speed (v s) and the feed rate (v w) on the micro-drilling hole size, surface morphology, surface roughness and subsurface damage depth were studied. Then, the micro-hardness on micro-drilling subsurface was analyzed. Finally, the subsurface recrystallization was explored. The results show that with the increase in v s , the hole diameter error and the surface roughness decrease, and the depth of subsurface plastic deformation layer decreases first and then increases; with the increase in v w , the error of hole diameter and the surface roughness increase, and the depth of the deformation layer decreases first and then increases. When v w > 0.33 μm/r, there are severe scratches on the surface of the hole wall, and the hole wall appears undulating stripes; white layer structure and severe plastic deformation layer appeared on the micro-drilling subsurface; the γ and γ' phases' deformation is severe; the micro-hardness at the subsurface white layer is small, and the micro-hardness value at the plastic deformation zone is large; after the hightemperature treatment, γ phase dissolves on the subsurface of micro-drilling parts, and the cellular recrystallization and the complete recrystallization occur. The minimum thickness of recrystallization layer obtained is 1.43 μm at v s = 141 m/min and v w = 0.105 μm/r. This study provides a good guidance and reference for the machining of nickel-based single-crystal superalloy micro-hole parts.

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Study on grinding force modelling and ductile regime propelling technology in micro drill-grinding of hard-brittle materials

Cited by 37 publications

References 29 publications

Desktop Micro-EDM System for High-Aspect Ratio Micro-Hole Drilling in Tungsten Cemented Carbide by Cut-Side Micro-Tool

Desktop Micro-EDM System for High-Aspect Ratio Micro-Hole Drilling in Tungsten Cemented Carbide by Cut-Side Micro-Tool

A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Study on hole quality and surface quality of micro-drilling nickel-based single-crystal superalloy

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