Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film

Lee, Young-Chul; Kim, Jong‐Woong; Kim, Kwang‐Seok; Yu, Chong-Hee; Jung, Seung-Boo

doi:10.5781/kwjs.2009.27.3.032

Journal of the Korean Welding and Joining Society

2009

DOI: 10.5781/kwjs.2009.27.3.032

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Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film

Young-Chul Lee¹,

Jong‐Woong Kim²,

Kwang‐Seok Kim³

et al.

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Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film

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