Study on Epoxy Resin Toughened by Epoxidized Hydroxy-Terminated Polybutadiene

Ge, Zhen; Zhang, Wenguo; Huang, Chao; Luo, Yunjun

doi:10.3390/ma11060932

Cited by 22 publications

(9 citation statements)

References 38 publications

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“…Typically, various elastomers with flexible molecular chains have been proven to efficiently improve the favorable toughness of epoxy resins, 9–12 but some of these epoxy‐based products usually suffer from the low tensile strength and deteriorated thermal performance. For example, Ge et al achieved the significant enhancement of the toughness of epoxy resin by using epoxidized hydroxy‐terminated polybutadiene (EHTPB), while a dramatically sacrifice was brought in the tensile strength of epoxy/EHTPB composites, the initial decomposition temperature and glass transition temperature ( Tg ) of the modified epoxy resin also decreased with the increase of EHTPB content 13 . Different from flexible modifiers, inorganic fillers, such as nano SiO 2, clay, graphene, glass beads, and glass fiber, can make up for the loss of rigidity caused by flexible segments 14–17 .…”

Section: Introductionmentioning

confidence: 99%

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

2021

J of Applied Polymer Sci

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Achieving synergetic improvements of mechanical strength, toughness, and thermal stability of epoxy resin has been a crucial but very challenging issue. Herein, to explore a new solution for circumventing this issue, polyimide microspheres were successfully prepared through the inverse nonaqueous emulsion process, and the structure, size distribution and morphologies of polyimide (PI) microspheres were comprehensively investigated. Then the PI microspheres were incorporated in epoxy resin matrix to systematically investigate the mechanical and thermal properties of obtained epoxy/PI microspheres composites. It was found that the PI microspheres can not only enhance the mechanical strength of epoxy resin, but also significantly improve the toughness. Specially, the epoxy‐based composites containing 3 wt% PI microspheres exhibit a 47% increase in tensile strength, while the GIC and Charpy impact strength increase by 106% and 200%, respectively. The toughing mechanism of epoxy/PI microspheres composites was discussed. Moreover, the PI microspheres can also endow the epoxy resin with excellent thermal stability and heat resistance. Thus, this work may open a new opportunity to synergistically enhance the mechanical and thermal properties of epoxy‐based composites and may also give some valuable inspiration for the rational design of other high‐performance thermosetting composites.

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Section: Introductionmentioning

confidence: 99%

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

2021

J of Applied Polymer Sci

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“…In Figure 10b, the fracture surface was similar to that of ductile material due to the plasticization effect of epoxidized PB phases [53]. During this type of deformation, the load was transferred more effectively to the nanostructured domains from the crosslinked epoxy phase [54].…”

Section: Resultsmentioning

confidence: 99%

A New Way of Toughening of Thermoset by Dual-Cured Thermoplastic/Thermosetting Blend

Khatiwada

Gohs

Lach³

et al. 2019

Materials

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The work aims at establishing the optimum conditions for dual thermal and electron beam curing of thermosetting systems modified by styrene/butadiene (SB)-based triblock copolymers in order to develop transparent and toughened materials. The work also investigates the effects of curing procedures on the ultimate phase morphology and mechanical properties of these thermoset–SB copolymer blends. It was found that at least 46 mol% of the epoxidation degree of the SB copolymer was needed to enable the miscibility of the modified block copolymer into the epoxy resin. Hence, an electron beam curing dose of ~50 kGy was needed to ensure the formation of micro- and nanostructured transparent blends. The micro- and nanophase-separated thermosets obtained were analyzed by optical as well as scanning and transmission electron microscopy. The mechanical properties of the blends were enhanced as shown by their impact strengths, indentation, hardness, and fracture toughness analyses, whereby the toughness values were found to mainly depend on the dose. Thus, we have developed a new route for designing dual-cured toughened micro- and nanostructured transparent epoxy thermosets with enhanced fracture toughness.

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“…The Crane equation [ 38 ] is used to determine the reaction order (n) of the curing kinetics, where n represents the complexity of the curing reaction.…”

Section: Curing Kinetic Parametersmentioning

confidence: 99%

Synthesis of antibacterial polyether biguanide curing agent and its cured antibacterial epoxy resin

Yang

Wang

et al. 2021

Designed Monomers and Polymers

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At present, bacteria continue to threaten human health, and the resistance of bacteria to antibiotics continues to increase, so the development of new antibacterial agents and antibacterial materials is increasingly important to ensure human health. In this paper, three polyether biguanide compounds with high antibacterial properties were synthesized by reacting polyetheramine T403 with o-tolylbiguanide, m-tolylbiguanide and p-tolylbiguanide (o-TTB, m-TTB and p-TTB), respectively. The antimicrobial performance of polyether biguanide against E. coli and S. aureus was evaluated using a minimum inhibitory concentration method, and the results showed that the synthesized polyether biguanide exhibited efficient and broad-spectrum antimicrobial effects. Among them, o-tolyl biguanide derivative o-TTB showed the best antimicrobial performance, with minimum inhibitory concentrations of 20 and 15 μg/mL against E. coli and S. aureus, respectively. Then, epoxy resin E51 was cured using the obtained TTB as a curing agent to prepare an epoxy resin with antibacterial properties. The inhibition of the growth of S. aureus by the cured o-TTB/E51 resin was investigated by incubating the cured epoxy resin with bacteria, and the results showed that the cured resin had a significant inhibitory effect on the growth of bacteria. The non-isothermal curing kinetics of the o-TTB/E51 system were investigated by differential scanning calorimetry (DSC) to determine the optimized curing reaction temperature, curing kinetic parameters and curing kinetics equation.

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Study on Epoxy Resin Toughened by Epoxidized Hydroxy-Terminated Polybutadiene

Cited by 22 publications

References 38 publications

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

A New Way of Toughening of Thermoset by Dual-Cured Thermoplastic/Thermosetting Blend

Synthesis of antibacterial polyether biguanide curing agent and its cured antibacterial epoxy resin

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