Study on epoxy resin based thermal adhesive composite incorporated with expanded graphite/silver flake hybrids

Kumar, Rajesh; Mohanty, Smita; Nayak, Sanjay K.

doi:10.1016/j.mtcomm.2019.100561

Cited by 16 publications

(8 citation statements)

References 62 publications

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“…With the addition of Cu nanoparticles, the nanoparticles penetrate the pores of the graphite sheets to form a so-called lamellar-sphere-lamellar structure, thereby decreasing the interfacial thermal resistance while also forming a thermal bridge between the graphite sheets; this promotes the construction of a continuous thermally conductive pathway (right-hand panel, Figure c). , Therefore, the TC of the DGEBA/EG/Cu composite can be increased by the addition of Cu nanoparticles. Consequently, as demonstrated in Figure d, the as-prepared epoxy/EG/Cu composites show a high TC of up to 9.74 W/(m·K), which is superior to that of previously reported epoxy/EG-filler-based composites and epoxy/copper-filler-based composites, where the highest reported TC was only 7 W/(m·K), even under a high loading of hybrid fillers. − ,− The DGEBA hybrid composite prepared in this study has excellent TC, but the content of hybrid fillers is relatively large. Future research will need to focus on further improving the TC of epoxy-based composites while maintaining a low hybrid filler content.…”

Section: Resultscontrasting

confidence: 56%

“…A single type of thermally conductive filler often needs to be added in significant quantities to achieve high TC in a polymer-based composite. This makes the preparation process difficult and also causes agglomeration of the filler and the formation of bubbles in the polymer matrix, thereby dramatically reducing the mechanical performance of the resulting composites. − Therefore, several researchers have reported the combined use of a variety of thermally conductive hybrid fillers to improve the TC of epoxy resin. − For example, Zhang et al studied the TC of epoxy composites containing Cu nanoparticles and multiwalled CNTs (MWCNTs) . They reported that the TC of a composite containing 15 wt % MWCNTs and 34 wt % Cu nanoparticles was 0.58 W/(m·K), which is 3.2 times greater than that of the pure epoxy resin sample.…”

Section: Introductionmentioning

confidence: 99%

“…Their results revealed that a composite containing 35 wt % hybrid fillers exhibited a TC of 3.6 W/(m·K). Furthermore, the same authors investigated the TC of hybrid epoxy composites containing EG and silver flake hybrids; they obtained a TC of 3.42 W/(m·K) by adding 30 wt % EG/Ag . Liu et al prepared reduced graphene oxide-encapsulated Cu sphere (Cu@rGO) hybrids and used them as fillers to improve the TC of epoxy resin .…”

Section: Introductionmentioning

confidence: 99%

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Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Cheng,

Chu,

Jin

et al. 2024

ACS Omega

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Epoxy resin is extensively applied in the electronics and electrical fields because of its outstanding comprehensive performance. However, the low thermal conductivity (TC) limits its application in thermal interface materials. In the present work, epoxy-based hybrid composites with high TC were prepared by using expanded graphite (EG) and copper (Cu) nanoparticles as thermally conductive hybrid fillers via hot blending and compression-curing processes. Additionally, the influence of the Cu content on the thermal properties, mechanical properties, and morphology of each epoxy/EG/Cu composite was investigated. According to the results, the epoxy/EG/Cu composite showed a maximum TC of 9.74 W/(m·K) at a fixed EG content of 60 wt % owing to the addition of 10 wt % Cu. After the addition of 10 wt % Cu, the flexural strength, flexural modulus, and impact strengths of epoxy/EG/Cu composites were improved from 27.9 MPa, 9.72 GPa, and 0.81 kJ/m2 to 37.5 MPa, 10.88 GPa, and 0.91 kJ/m2, respectively. Hence, this study offers a feasible strategy for the design of epoxy hybrid composites with excellent TC that can be applied to thermal interface materials.

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Section: Resultscontrasting

confidence: 56%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Cheng,

Chu,

Jin

et al. 2024

ACS Omega

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“…(Figure 1h). [38,41,44,[49][50][51][52][53][54][55] The lattice structure of the HITC-Ag nanoflakes were investigated using high-resolution TEM (HRTEM) and X-ray diffraction (XRD). As shown in Figure 1i,j, no lattice defects were detected in sizable selections, and the measured interplanar spacings of (111) and (200) planes are 0.235 and 0.200 nm (Figure 1j), respectively.…”

Section: Preparation and Characterization Of Hitc-ag Nanoflakesmentioning

confidence: 99%

Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives

et al. 2023

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The rapid development of highly integrated microelectronic devices causes urgent demands for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat‐transfer issue. Due to their natural 2D structure and isotropic thermal conductivity, metal nanoflakes are promising fillers blended with polymer to develop high‐performance TCAs. However, achieving corresponding TCAs with thermal conductivity over 10 W m−1 K−1 at filler content below 30 vol% remains challenging so far. This longstanding bottleneck is mainly attributed to the fact that most current metal nanoflakes are prepared by “bottom‐up” processes (e.g., solution‐based chemical synthesis) and inevitably contain lattice defects or impurities, resulting in lower intrinsic thermal conductivities, only 20–65% of the theoretical value. Here, a “top‐down” strategy by splitting highly purified Ag foil with nanoscale thickness is adopted to prepare 2D Ag nanoflakes with an intrinsic thermal conductivity of 398.2 W m−1 K−1, reaching 93% of the theoretical value. After directly blending with epoxy, the resultant Ag/epoxy exhibits a thermal conductivity of 15.1 W m−1 K−1 at low filler content of 18.6 vol%. Additionally, in practical microelectronic cooling performance evaluations, the interfacial heat‐transfer efficiency of the Ag/epoxy achieves ≈1.4 times that of the state‐of‐the‐art commercial TCA.

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“…In recent years, there has been a growing interest in the development of silver epoxy adhesives with improved electrical conductivity [ 15 , 16 , 17 ]. The electrical conductivity of these conductive compositions can be modified by selecting the proper size, shape, and type of filler [ 18 , 19 , 20 ].…”

Section: Introductionmentioning

confidence: 99%

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

et al. 2023

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With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of H2O into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs.

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Study on epoxy resin based thermal adhesive composite incorporated with expanded graphite/silver flake hybrids

Cited by 16 publications

References 62 publications

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

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