Study on ductile-mode mirror grinding of SiC ceramic freeform surface using an elliptical torus-shaped diamond wheel

Xie, Jianhe; Li, Q.; Sun, Jining; Li, Y.H.

doi:10.1016/j.jmatprotec.2015.03.027

Cited by 56 publications

(14 citation statements)

References 14 publications

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“…Due to high specific stiffness, high chemical inertness, high thermal conductivity and enhanced radiation stability, silicon carbide (SiC) is emerging as a prime candidate for several engineering applications, which are common in combustion environments, military-grade vehicle control sensing and space exploration [ 1 , 2 , 3 , 4 ]. However, as a typical hard and brittleness material, hot pressed (HP)-SiC is difficult to machine as it always generating surface defects and considerable subsurface damage during processing, which affects the lifetime of components.…”

Section: Introductionmentioning

confidence: 99%

Strain Rate Effect on the Ductile Brittle Transition in Grinding Hot Pressed SiC Ceramics

Huang

Zhang

2020

Micromachines

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Surface and subsurface damage are still persistent technical challenges for the abrasive machining hot pressed-silicon carbide (HP-SiC) ceramics. Therefore, an investigation of the material behavior and critical depth of ductile to brittle transition (DBT) is essential for improving high precision and quality grinding HP-SiC ceramics. In this paper, single-grit grinding experiments with different scratch speed were conducted to study strain rate effect on the critical depth of DBT. The nanoindentations were performed to test the hardness and Young’s modulus changes of DBT position under different scratch speeds. The material removal mechanism and phase changes underneath the scratch groove were investigated using Raman tests. Based on the specific energies consumed in ductile and brittle modes of machining, a theoretical model of the critical depth of DBT was developed. The experimental results suggest that high scratch speeds generate high nanohardness, high Young‘s modulus and high critical depth of DBT of HP-SiC ceramics. The measured critical depth of DBT shows a good agreement with the predicted value calculated by the developed model. The subsurface damage depth reduced with high strain rate. Furthermore, the Raman results revealed that dislocations and amorphous transformation dominated the ductile removal mechanism of HP-SiC grinding. The fracture chips and subsurface damage depth was determined by the lateral crack and median crack, respectively. This paper’s results provide a fundamental understanding of the effect of grinding speed on the material removal mode of HP-SiC ceramics.

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Section: Introductionmentioning

confidence: 99%

Strain Rate Effect on the Ductile Brittle Transition in Grinding Hot Pressed SiC Ceramics

Huang

Zhang

2020

Micromachines

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“…Among the various machining methods, polishing is the last step to obtain good surface integrity. However, SiC ceramics have poor machinability due to their high hardness and brittleness [1,2,3,4]. The surface and subsurface damages may seriously deteriorate the quality of optical parts under thermal load during machining [5].…”

Section: Introductionmentioning

confidence: 99%

Analytical Prediction of Subsurface Damages and Surface Quality in Vibration-Assisted Polishing Process of Silicon Carbide Ceramics

et al. 2019

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Subsurface damages and surface roughness are two significant parameters which determine the performance of silicon carbide (SiC) ceramics. Subsurface damages (SSD) induced by conventional polishing could seriously affect the service life of the workpiece. To address this problem, vibration-assisted polishing (VAP) was developed to machine hard and brittle materials, because the vibration-assisted machine (VAM) can increase the critical cutting depth to improve the surface integrity of materials. In this paper, a two-dimensional (2D) VAM system is used to polish SiC ceramics. Moreover, a theoretical SSD model is constructed to predict the SSD. Furthermore, finite element simulation (FEM) is adopted to analyze the effects of different VAP parameters on SSD. Finally, a series of scratches and VAP experiments are conducted on the independent precision polishing machine to investigate the effects of polishing parameters on brittle–ductile transition and SSD.

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“…J. G. Cao et al [15] analyzed material removal mechanism by simulation and experiment process when processing SiC ceramic using ultrasonic assisted grinding method. J. Xie et al [16] established a cutting depth model and analyzed micro brittle cracks when grinding SiC ceramic used elliptic diamond grinding wheel. K. Zhang et al [17] studied the material removal mechanism using single-layer brazing diamond grinding wheel to grind SiC ceramic.…”

Section: Introductionmentioning

confidence: 99%

Drilling Mechanism Investigation on SiC Ceramic Using Diamond Bits

Gao¹,

Wu²,

Wang³

2017

TOMEJ

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Background: SiC ceramic have been widely used in the fields of armor protection, but SiC ceramic is one of the difficult-to-machine material for its high hardness and low fracture toughness. Objective: This paper presents an investigation of drilling mechanism on SiC ceramic using diamond bits. Method: Based on the theory of indentation fracture mechanics model, cutting average load model and cutting average depth model for single particle were established, theory analysis of drilling mechanism was carried out; through scanning electron microscope (SEM) observation, experimental removal mechanism was discussed. Results and Conclusions: The results show that, brittle fracture is the dominant way for SiC ceramic’s removal mechanism, plastic deformation always exists during the drilling process. Brittle fracture includes cleavage fracture, transgranular fracture, intergranular fracture, material peeling off and grain boundary breakage; resintering and recrystallization happen under the joint action of grinding forces and grinding heat in the contact area, where plastic flow characteristics also appear; powdering removal is accompanied by the drilling process; cleavage fracture and transgranular fracture occur on intergranular pores and grain boundary; residual cracks are found in the drilling surface resulted by drilling stress and high temperature.

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Study on ductile-mode mirror grinding of SiC ceramic freeform surface using an elliptical torus-shaped diamond wheel

Cited by 56 publications

References 14 publications

Strain Rate Effect on the Ductile Brittle Transition in Grinding Hot Pressed SiC Ceramics

Strain Rate Effect on the Ductile Brittle Transition in Grinding Hot Pressed SiC Ceramics

Analytical Prediction of Subsurface Damages and Surface Quality in Vibration-Assisted Polishing Process of Silicon Carbide Ceramics

Drilling Mechanism Investigation on SiC Ceramic Using Diamond Bits

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