Study on critical rake angle in nanometric cutting

Lai, Min; Zhang, X. D.; Fang, Fengzhou

doi:10.1007/s00339-012-6973-8

Cited by 65 publications

(46 citation statements)

References 15 publications

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“…This cycle continues to repeat, periodic patterns keep forming, and thus brittle cracks are pressed and advances further by the pushing of the amorphous silicon. As noted by Lai et al [44], the stagnation point for a particular tool varies only with the cutting depth, and is independent of the radius and critical angles of the tool. The implication of this phenomenon is that a more negative inclined tool edge (rake angle) will result in deeper sub-surface damage caused by the formation of such periodically appearing cavities.…”

Section: Surface Generation Process and Brittle Fracturementioning

confidence: 85%

Influence of microstructure on the cutting behaviour of silicon

et al. 2016

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General rights Copyright for the publications made accessible via the Queen's University Belfast Research Portal is retained by the author(s) and / or other copyright owners and it is a condition of accessing these publications that users recognise and abide by the legal requirements associated with these rights. Abstract:We use molecular dynamics simulation to study the mechanisms of plasticity during cutting of monocrystalline and polycrystalline silicon. Three scenarios are considered: (i) cutting a single crystal silicon workpiece with a single crystal diamond tool, (ii) cutting a polysilicon workpiece with a single crystal diamond tool, and (iii) cutting a single crystal silicon workpiece with a polycrystalline diamond tool. A long-range analytical bond order potential is used in the simulations, providing a more accurate picture of the atomic-scale mechanisms of brittle fracture, ductile plasticity, and structural changes in silicon. The MD simulation results show a unique phenomenon of brittle cracking typically inclined at an angle of 45° to 55° to the cut surface, leading to the formation of periodic arrays of nanogrooves in monocrystalline silicon, which is a new insight into previously published results. Furthermore, during cutting, silicon is found to undergo solid-state directional amorphisation without prior Si-I to Si-II (beta tin) transformation, which is in direct contrast to many previously published MD studies on this topic. Our simulations also predict that the propensity for amorphisation is significantly higher in single crystal silicon than in polysilicon, signifying that grain boundaries eases the material removal process.

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Section: Surface Generation Process and Brittle Fracturementioning

confidence: 85%

Influence of microstructure on the cutting behaviour of silicon

et al. 2016

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“…Promyoo [9] studied the chip formation mechanism with tool rake angle in nanometric cutting single crystal copper, it is found that cutting force、thrust force and the ratio of thrust to cutting force decreasing with the increasing of tool rake angle and the chip thickness decreased with the increase of the rake angle. Lai [10]studied the critical rake angle in nanometric cutting single crystal copper by molecular dynamics simulation method, results showed that the minimum effective rake angle for chip formation is -65º~ -70º,when the effective rake angle is -80 º,chip formation even pile-up formation does not occur in nanometric cutting.…”

Section: Introductionmentioning

confidence: 99%

Simulation Analysis of the Effects of Tool Rake Angle for Workpiece Temperature in Single Crystal Copper Nanometric Cutting Process

Jiang-hua¹,

Zhang²,

Wang³

et al. 2016

IJHIT

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“…16 Cutting with an edge radius tool, a stagnation point, b stagnation zone Fig. 17 Stagnation region on the 3D simulation snapshot [120] Nanomanufacturing and Metrology (2018) 1:4- 31 15 coefficient could reduce the minimum UCT [122]. Malekian et al [118] investigated the minimum UCT using the minimum energy approach and infinite shear strain method.…”

Section: Influence On Chip Formation and Minimum Uctmentioning

confidence: 99%

“…Lai et al [120] applied 3D molecular dynamics to investigate the effective rake angle of the stagnation region which is almost a point. The relationship between the minimum UCT and tool edge radius has been found.…”

Section: Influence On Chip Formation and Minimum Uctmentioning

confidence: 99%

“…The first approach is based on the existence of a stagnation point on the tool round edge, below which the material flows under the tool to form the machined surface and above which the material flows up along the tool face to form chip [120]. Fang [19,20] comprehensively defines the tool edge roundness by four variables.…”

Section: Influence On Chip Formation and Minimum Uctmentioning

confidence: 99%

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Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

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Micro-and nano-machining technology has been applied in industry to generate high-precision parts with micro/nanometric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro-and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the indepth understanding of the micro/nano-cutting process.

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Study on critical rake angle in nanometric cutting

Cited by 65 publications

References 15 publications

Influence of microstructure on the cutting behaviour of silicon

Influence of microstructure on the cutting behaviour of silicon

Simulation Analysis of the Effects of Tool Rake Angle for Workpiece Temperature in Single Crystal Copper Nanometric Cutting Process

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

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