Study on Convective Flow Behaviors of Phosphor Particles During Curing Process of Silicone and the Influences on the Optical Performance of White LEDs

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

“…To avoid the possible accumulation of the particles at the edge of the electrode due to the large temperature gradient at the early stage of the curing process, the temperature was set to increase gradually from 25 to 80 °C in 30 min and kept constant afterward. 65 The upper electrode was achieved by spin-coating an Ag nanowire solution (5 wt % water solution) at a speed of 2000 rpm on the cured insulating PDMS layer, on which a 5 min hydrophilic treatment was performed in advance by an O 2 plasma. Finally, after the package layer was cured, the EL device was obtained by carefully peeling off the PI film from the Si substrate.…”