Study on contact angles of Au, Ag, Cu, Sn, Al and Al alloys to SiC

Takahashi, Shouji; Kuboi, Osamu

doi:10.1007/bf00372193

Cited by 27 publications

(7 citation statements)

References 3 publications

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“…In Table 1, the contact angle values are given for Au, Ag, Cu, and Zn, on graphite (11), vitreous silica (12 -14), silicon carbide (15) and boron nitride (12). These types of ceramic materials, prevalently covalent, have a close electronic configuration with strong interatomic bonds, and were therefore chosen for evaluation as crucible materials for melting gold alloys.…”

Section: Wettabilitymentioning

confidence: 99%

Wetting and surface tension measurements on gold alloys

Ricci

Novaković

2001

Gold Bull

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The surface tension and the density of some gold alloys have been measured and their wetting behaviour investigated in relation to different ceramic supports. Relationships between surface tension and density as a function of temperature are proposed.The primary objective of jewellery production is the optimization of melting processes (1) and the choice of suitable ceramic materials for the crucibles is required, and this choice can be critical. Accordingly, there is a need for a range of materials with excellent thermal and mechanical properties to withstand high temperatures and, at the same time, resist attack by the molten metal, so that there is no metal-ceramic interaction (2, 3). To date, the materials used have been graphite, silicon carbide or the more common 'refractory materials', but there are still complaints about problems, principally related to the rapid consumption of the crucible, or pollution of the melt due to the detachment of particles from the crucible. A knowledge of the interaction between the ceramic and the liquid gold alloys can help in the definition of more suitable ceramic material for the melting processes used by goldsmiths. It is necessary to use materials that are highly resistant to wetting by metallic melts, thus a knowledge of the interface properties of liquid gold alloys in relation to ceramic materials is needed.The interactions between the liquid metallic material and the ceramic are usually studied using: 1 Surface tension measurements of the liquid metal in contact with the ceramic material 2 Measurements of both surface tension and contact angle as a function of temperature 3 Surface tension measurements in the presence of liquid metal vapour. Ott (4) has stated that there is insufficient data on the thermal properties of jewellery alloys in the liquid state and at solidification, including that on surface /interface tension. Surface tension is a thermophysical property that must be considered because it influences the surface structure of castings, and determines the interfacial interactions between melts and solid containers (ie interfacial tensions); and it is influenced by the presence of alloying elements such as zinc or silicon. Consequently, the study of its variation can provide useful information on the outcome of casting processes. We have therefore measured the surface tension and the density of some precious gold alloys as a function of temperature, and investigated their wetting behaviour on a number of relevant ceramic supports. THEORETICAL BACKGROUNDFor the sake of clarity, we provide some details on the nature of adhesion and wettability of liquid metals on solid substrates and the behaviour of surface tension. WettabilityOne of the basic equations which describes the behaviour of a liquid phase in contact with a solid surface is Young's equation (5):where σ SV , σ SL , σ LV are respectively the interface energies between the solid and the vapour phase, the solid and the liquid phase, and the liquid and the

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Section: Wettabilitymentioning

confidence: 99%

Wetting and surface tension measurements on gold alloys

Ricci

Novaković

2001

Gold Bull

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“…TCON, developed and marketed by Fireline TCON Inc., was identified as another possible candidate material. The rational for this was that SiC has been shown previously to be highly nonwetting when in contact with molten aluminum 3–5 . Additionally, it was expected that this material would exhibit corrosion resistance to molten metal contact due to the low porosity and high alumina/low silica content and abrasion/wear resistance to damage caused by mechanical dross removal.…”

Section: Development Of New Materialsmentioning

confidence: 99%

Development and Application of Refractory Materials for Molten Aluminum Applications

Hemrick

Headrick

Peters³

2008

Int J Applied Ceramic Tech

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Two new refractory materials have been developed for use in molten aluminum contact applications that exhibit improved corrosion and wear resistance leading to improved thermal management through reduced heat losses caused by refractory thinning and wastage. The development of these materials was based on an understanding of the corrosion and wear mechanisms associated with currently used aluminum contact refractories through physical, chemical, and mechanical characterization and analysis performed by Oak Ridge National Laboratory (ORNL) and the University of Missouri, Rolla Rolla (UMR), along with their industrial partners, under the ITP Materials project ''Multifunctional Metallic and Refractory Materials for Energy Efficient Handling of Molten Metals.'' Spent castable refractories obtained from a natural gas-fired reverberatory aluminum alloy melting furnace were analyzed, leading to identification of several refractory degradation mechanisms and strategies to produce improved materials. The newly developed materials have been validated through an R&D industrial trial.

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“…Electronic solders 4 , such as SnAg, BiSn, and AuSn, are widely used for the bonding of electronic components. However, these solders exhibit poor wettability with ceramics and cannot be used for the direct soldering of ceramics 5 , 6 . To overcome the poor bonding nature of solder on ceramic surfaces, a standard industrial process for soldering ceramics that involves a premetallization step prior to soldering has been used 7 – 9 .…”

Section: Introductionmentioning

confidence: 99%

Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds

Leng

Xiu

et al. 2018

Sci Rep

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With the aim of overcoming the limitations of traditional soldering ceramic methods for power device packaging, a simple but ultrafast bonding technology is reported. The effect and mechanism of ultrasonic action on the interfacial bonding and microstructure is investigated and thoroughly discussed. An ultrafast interfacial bond between SiC ceramics and SnAgTi active solder has been successfully achieved through a reaction at the interface at a low temperature of 250 °C in the extremely short time. High-resolution transmission electron microscopy (HRTEM) revealed that a silica layer on the surface of SiC reacted with Ti from the SnAgTi active solder to form a nanometer-thickness amorphous titania layer at the interface under the ultrasonic action, which creates an exceptional interfacial structure and facilitates bonding between the two dissimilar crystals. A discontinuous titania layer at the interface was identified within 0.1 s. With further increasing ultrasonic action time to 1 s, a continuous titania layer with a thickness of 7.6 ± 0.5 nm formed at the interface. A new interfacial reaction mechanism was revealed and it was found that ultrasound accelerated the reaction of liquid active solder/ceramic. Our finding demonstrated that ultrasound could be an effective approach for joining ceramics which is difficult to wet by a liquid metal at low temperature. The combined impact of ultrasonic cavitation and streaming dominated the mechanism and kinetics of the rapid interfacial reaction.

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Study on contact angles of Au, Ag, Cu, Sn, Al and Al alloys to SiC

Cited by 27 publications

References 3 publications

Wetting and surface tension measurements on gold alloys

Wetting and surface tension measurements on gold alloys

Development and Application of Refractory Materials for Molten Aluminum Applications

Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds

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