Abstract:Critical dimension uniformity (CDU) of hole layer is becoming more and more crucial alongside with the technology node being driven into 28 nm and beyond, since the critical dimension (CD) variation of 2-dimensional (2D) hole pattern is inherently larger than that of 1D pattern (line/space). As the process window becomes more marginal with the more advanced technology node, EFESE tilt (focus drilling method) is a simple but useful way to enhance depth of focus (DOF) (1-4). Despite the compromises in image cont… Show more
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