Study on a 3D packaging structure with benzocyclobutene as a dielectric layer for radio frequency application

Geng, Fang; Ding, Xiaoyun; Li, Luo

doi:10.1109/icept.2009.5270787

Cited by 4 publications

(2 citation statements)

References 9 publications

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“…Accordingly the process cost is also reduced. Besides, instead of traditional sophisticated process applying dry-etch BCB, this kind of interlayer connections are formed by cost-effective photo-BCB lithography and the interlayer connection formed by electroplating is only 3μm , avoiding expensive dry-etch process, low reliability and long fabrication cycle, such as CMP, Au bump bonding or column electroplating [8][9].…”

Section: Introductionmentioning

confidence: 99%

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Tang

Wang

Xiao

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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This paper presents a wafer-level microwave multichip module (MMCM) packaging process for 24GHz driver amplifier using photosensitive-Benzocyclobutene (photo-BCB) of 25μm. It is developed for multilayer interconnection of monolithic microwave integrated chip (MMIC). A 24GHz driver amplifier chip is embedded in a wet-etched trench on 4 inch lossy Si wafer and covered with a layer of BCB as dielectrics. Microstrip lines are fabricated with two layers of metal patterns to connect pads on MMIC with the test pads on MCM package in case of excessive loss. The interlayer connection resistance of this metal/BCB interconnection structure is tested with interconnection chain structures through Kelvin resistance measurement. The electrical characteristics of the package are also illustrated. The gain of the amplifier (S 21 ) after packaging is more than 22dB from 21GHz to 26 GHz, and the S 21 changes when packaged is less than 2 dB. The return loss S 11 and S 22 is less than -14.1dB and -17.3dB from 21GHz to 26GHz.

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Section: Introductionmentioning

confidence: 99%

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Tang

Wang

Xiao

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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“…Another group coated metal lines with Parylene and submerged them in a heated bath (55ºC) of isotonic saline for a period of 5 months [5]; the experiment showed that the impedance of the lines did not change significantly over the duration. Low dielectric constant Benzocyclobutene (BCB) was used to coat IC chips and passive components in an embedded silicon substrate [6].…”

Section: Introductionmentioning

confidence: 99%

Conformal thin film packaging for sic sensor circuits in harsh environments

Scardelletti

Karnick

Ponchak

et al. 2011

2011 IEEE Topical Conference on Wireless Sensors and Sensor Networks

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-In this investigation sputtered silicon carbide annealed at 300 º C for one hour is used as a conformal thin film package. A RF magnetron sputterer was used to deposit 500 nm silicon carbide films on gold metal structures on alumina wafers. To determine the reliability and resistance to immersion in harsh environments, samples were submerged in gold etchant for 24 hours, in BOE for 24 hours, and in an O 2 plasma etch for one hour. The adhesion strength of the thin film was measured by a pull test before and after the chemical immersion, which indicated that the film has an adhesion strength better than 10 8 N/m 2 ; this is similar to the adhesion of the gold layer to the alumina wafer. MIM capacitors are used to determine the dielectric constant, which is dependent on the SiC anneal temperature. Finally, to demonstrate that the SiC, conformal, thin film may be used to package RF circuits and sensors, an LC resonator circuit was fabricated and tested with and without the conformal SiC thin film packaging. The results indicate that the SiC coating adds no appreciable degradation to the circuits RF performance.

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3D IC and RF SiPs

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Study on a 3D packaging structure with benzocyclobutene as a dielectric layer for radio frequency application

Cited by 4 publications

References 9 publications

An MCM package process for 24GHz driver amplifier using photosensitive BCB

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Conformal thin film packaging for sic sensor circuits in harsh environments

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