Study of Zn6Al6Ag Alloy Application in Ultrasonic Soldering of Al2O3–(Al/Al2O3) Joints

Abstract

The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal–ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C. The solder microstructure consists of a (Zn) + (Al) matrix, reinforced with a silver AgZn3 phase. A bond with the metal–ceramic composite was formed due to the dissolution of Al in the liquid Zn solder. The Al2O3 particles were put into motion, and a new composite was formed on the boundary. The Zn6Al6Ag solder also wetted the surface of the Al2O3 ceramic. A decisive effect on bond formation was caused by zinc and aluminum, whose oxides were combined with the oxides of ceramic material during in-air soldering. An adhesive bond was formed. The average joint shear strength of Al2O3/metal–ceramic composite (Al/Al2O3) was found to be 23 MPa.

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

“…Wedge bonding is also a type of wire bonding, as already described, and widely used in the At this stage, the bonding is completed after heating and pressing. The central part indicates the joint after the ball bonding, which is un-bonded, and the outer area is the bonded region [100][101][102][103][104].…”

“…At this stage, the bonding is completed after heating and pressing. The central part indicates the joint after the ball bonding, which is un-bonded, and the outer area is the bonded region[101][102][103][104][105].…”

Investigation of microstructure evolution and mechanical properties of 2024 Al/Al2O3 ceramic joints

“…The acoustic cavitation and acoustic streaming [13,14] can break the oxide film of metals and make Sn-based solder spread out quickly on the surface of Al 2 O 3 ceramic. As an advanced process of joining ceramic, ultrasonic soldering process has been studied by many scholars [15][16][17][18]. Koleňák et al [18] successfully realised the ultrasonic soldering of AIN ceramics with Cu substrate using Sn-Ag-Ti solder.…”