Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method

Liu, D. S.; Chao, Yang; Wang, C. H.

doi:10.1016/s0168-874x(02)00226-3

Cited by 59 publications

(29 citation statements)

References 9 publications

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“…However, there are some problems like sizes, constraints, loading rates for wires in the test and industrial practice. Liu et al presented a threedimensional finite element model to simulate a real wire bond looping with the 1.1 mm span in industrial practice [12]. An empirical temperature-dependent elasto-plastic constitutive equation, as the material behavior of gold wire, was used in simulation.…”

Section: Mechanical Models Of Bonding Wirementioning

confidence: 99%

High-speed video analysis for kink formation in a bond wire looping

Han

2014

Microelectronics Reliability

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Section: Mechanical Models Of Bonding Wirementioning

confidence: 99%

High-speed video analysis for kink formation in a bond wire looping

Han

2014

Microelectronics Reliability

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“…To avoid rigid body motion, the first node located at zero coordinate is a fixed point (U X = U Y = U Z = 0). In addition, a linear elasticity condition is applied to all materials (see Table 2), except gold which is considered as a bi-linear elastoplastic material [15].…”

Section: Modelling Detailsmentioning

confidence: 99%

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Cauchois

Yin

Gouantes

et al. 2013

Microelectronics Reliability

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Abstract:RFID solutions will improve the traceability of biological samples stored at low temperature (77K) in biobanks. To achieve this goal, the reliability of RFID tags is essential. In this paper, we focus on the reliability aspect of RFID tags in harsh environment and more specifically to assembly design optimization through numerical simulations and accelerated life tests. A packagedimensioned model and a wire-interconnect centered model have been used to assess stress distribution in the package and wire bonds. We also develop a specific versatile test bench to apply thermal cycling while monitoring the functionality of the tags. We investigate 3 different tag configurations and demonstrate that the main failure mode is related to wire breaks. The occurrence of this failure depends mainly on the nature and thickness of the encapsulant resin which induce compressive and tensile stresses during thermal cycling. FEM results are in good agreement with observed failures.

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“…The constitutive relation of a gold bump has not yet been reported in the literature, but the constitutive relation of gold wire developed by Liu et al [12] (see Eq. (1)) can be used because a gold bump is made of gold wire with a wire bonder.…”

Section: Physical Model Of the Thermosonic Flip Chip Bonding Processmentioning

confidence: 99%