2008 IEEE Nuclear Science Symposium Conference Record 2008
DOI: 10.1109/nssmic.2008.4774872
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Study of the radiation hardness of silicon sensors for the XFEL

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Cited by 9 publications
(2 citation statements)
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“…For this x-ray energy displacement damage effects can be excluded. I/V-, C/V-and TDRC-(Thermally Dielectric Relaxation Current)-measurements on gate controlled diodes and CMOS capacitors fabricated by CiS [14] on 2 kΩcm n-type float zone (FZ) Si have shown that oxide charge density, interface trap density and surface generation velocity saturate, and even decrease beyond a dose of several MGy [11]. Based on the results at…”
Section: Pixel Sensors For the Xfelmentioning
confidence: 99%
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“…For this x-ray energy displacement damage effects can be excluded. I/V-, C/V-and TDRC-(Thermally Dielectric Relaxation Current)-measurements on gate controlled diodes and CMOS capacitors fabricated by CiS [14] on 2 kΩcm n-type float zone (FZ) Si have shown that oxide charge density, interface trap density and surface generation velocity saturate, and even decrease beyond a dose of several MGy [11]. Based on the results at…”
Section: Pixel Sensors For the Xfelmentioning
confidence: 99%
“…In the second part (section 2.2) the influence of surface damage effects induced by 12 keV x-rays on the static properties of a proposed n + n FZ Si pixel sensor for the application at the European XFEL is outlined. Here the relevant damage parameters (change of the fixed oxide charge N ox, density of interface traps N it (cm -2 ) and the density of interface traps D it (cm -2 eV -1 )) were taken from experimental data [10,11] and implemented into the Synopsys-TCAD PoS(RD09)019 simulation program. Simulated distributions of the electric potential, electron density and electric field for a specific sensor layout and a given set of damage parameters will be presented and discussed.…”
Section: Introductionmentioning
confidence: 99%