Study of the performance of an integrated liquid cooling heat sink for high-power IGBTs

Pan, Mei; Hu, Minglong; Wang, hongqing

doi:10.1016/j.applthermaleng.2021.116827

Cited by 35 publications

(4 citation statements)

References 35 publications

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“…In the continuation of this research, the angle of the heat sink was investigated in different models. The best performance was shown for the heatsink with the integrated vapor chamber at an angle of 60 degrees [26]. Guowei et al investigated the thermal operation of the IGBT power module using a heat pipe.…”

Section: Introductionmentioning

confidence: 99%

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

elmi,

Lavasani,

Dinarvand

et al. 2024

Preprint

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Keeping the operating temperature in the allowable range of the power module, under a very high heat flux, is of particular importance in the performance of the systems and their reliability. In this investigation, as a new approach, a new hybrid thermal heat sink consisting of phase change material with different arrangement and mass flow rates has been used for cooling an Insulatedgate bipolar transistor. As an innovation, to reduce the operating temperature of the power module at a heat flux of 100 W/cm2, the paraffin and Metal-based PCM have been applied in the water cooling chamber and simulated simultaneously. The finite volume method and piezo algorithm was used to solve the governing equations. Then, the effect of the flow rate and arrangement of PCMs on temperature variations of the power module has been examined in terms of time. The melting process of the PCM was numerically simulated by the enthalpy-porosity method in threedimensional computational domain. The results revealed that using the metal-based PCM compared to paraffin due to its high thermal conductivity increased the heat transfer rate. As a result, the operating temperature of the power module decreased. Also, metal-based PCM in 4 different arrangements (A,B,C,D) performs better than the conventional cooling system. Finally, it reduced the operating temperature of the power module. Based on the results obtained at flow rates of 0.0025, 0.00375, and 0.005 kg/s, arrangement Case D showed the best performance by reducing 3 °C compared to the pure working fluid in the power module.

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Section: Introductionmentioning

confidence: 99%

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

elmi,

Lavasani,

Dinarvand

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…Several technologies, including thermoelectric cooling, heat pipes, and air‐cooling processes, have been used to alleviate overheating problems in electronic devices. Among these techniques, the heat sink is one of the most commonly used cooling systems in IGBT modules, and it considerably enhances heat dissipation 4,5 . Copper (Cu) and aluminum (Al) are conventional heat sink materials due to their superior conductivity, but they exhibit high thermal expansion, which causes cracking or detachment from the ceramic‐based IGBT module 6,7 …”

Section: Introductionmentioning

confidence: 99%

“…Among these techniques, the heat sink is one of the most commonly used cooling systems in IGBT modules, and it considerably enhances heat dissipation. 4,5 Copper (Cu) and aluminum (Al) are conventional heat sink materials due to their superior conductivity, but they exhibit high thermal expansion, which causes cracking or detachment from the ceramic-based IGBT module. 6,7 SeungHyun Lee and Sung-hun Son contributed equally to this study.…”

Section: Introductionmentioning

confidence: 99%

Heat conduction and thermal expansion of copper–graphite composite as a heat sink

Lee

Son

Kim

et al. 2022

Intl J of Energy Research

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Summary This study presents the evaluation of the heat transfer characteristics and mechanical deformation of new composite material heat sinks using experimental and computational approaches. First, we synthesized a composite material composed of copper (Cu) and graphite (C) with 60 wt% Cu, with higher thermal conductivity and a lower thermal expansion coefficient than pure Cu and aluminum. The composite material was used to fabricate a heat sink integrated with an insulated‐gate bipolar mode transistor (IGBT) module for enhanced heat dissipation from the IGBT. Compared with the pure Cu heat sink, the composite heat sink decreases the average temperature of the IGBT module by approximately 22 K. It also decreases the total deformation of the heat sink caused by thermal expansion of the material by 78% and the equivalent stress by 25.2%. This study introduces a way to use Cu‐C composite materials in many potential applications, such as heat sinks integrated with IGBT inverters.

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“…Other than efficient heat transfer, heat removal in flexible electronics also requires highly flexible thermal solutions, such that they can be applied on curved and soft surfaces. In microelectronics, the escalating integration density in the last six decades has pushed forward the computing capabilities at the cost of rising heat dissipation across the device, circuit, and system levels. , To date, the heat fluxes of high-power electronic devices and systems such as SiC high-electron-mobility transistors, solid-state lasers, and phased-array radars, can reach the order of 1 kW/cm 2 . − Heat rejection technology has been playing a critical role in maintaining the Moore’s law scaling in the microelectronics industry . Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials are still the crucial barriers for thermal transport because of the intrinsic material dissimilarity and surface roughness at interfaces.…”

mentioning

confidence: 99%

3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness

et al. 2023

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Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D graphenenanowire "sandwich" thermal interface that enables an ultralow thermal resistance of ∼0.24 mm 2 •K/W that is about 1 order of magnitude smaller than those of solders and several orders of magnitude lower than those of thermal greases, gels, and epoxies, as well as a low elastic and shear moduli of ∼1 MPa like polymers and foams. The flexible 3D "sandwich" exhibits excellent long-term reliability with >1000 cycles over a broad temperature range from −55 °C to 125 °C. This nanostructured thermal interface material can greatly benefit a variety of electronic systems and devices by allowing them to operate at lower temperatures or at the same temperature but with higher performance and higher power density.

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Study of the performance of an integrated liquid cooling heat sink for high-power IGBTs

Cited by 35 publications

References 35 publications

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

Heat conduction and thermal expansion of copper–graphite composite as a heat sink

3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness

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