Study of the Interaction between Composite Solders and Diamond

Artem'ev, V. P.; Sokolov, E. G.; Kozachenko, A. D.

doi:10.1007/s11041-013-9626-4

Cited by 5 publications

(3 citation statements)

References 3 publications

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“…It can be seen that the liquid phase has wet the diamonds and formed a less than 90° contact angle with their surface. This is explained by the dissolved cobalt being present in the liquid phase, because a liquid phase containing copper and tin only does not wet diamonds [7,[14][15][16].…”

Section: Resultsmentioning

confidence: 99%

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Structure Formation during Liquid-Phase Sintering of the Diamond-Containing Composites with Sn-Cu-Co-W Binders

Sokolov

2018

SSP

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Structure formation of diamond-containing composites with Sn-Cu-Co-W binders has been studied within the range of sintering temperatures of 780–820°C. The specimens were obtained by rolling the paste-like mixtures of metallic powders and diamonds on steel substrates, with sintering performed in vacuum. The structure of the sintered specimens was studied by optical metallography, X-ray diffractometry and electron probe microanalysis. Hardness of the materials was identified by Rockwell method (scale B). It has been found that the process of composites sintering is largely affected by oxide films available on the surface of the powders. In order to obtain composites having less than 10% porosity and up to 96–98 HRB hardness, they have to be sintered at the temperature of 820°C which eliminates the oxide films.

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Section: Resultsmentioning

confidence: 99%

“…shaped stone-working rollers, by compaction in molds. For fabrication of such tools, composite soldering can be used [7][8][9]. Its essence is as follows.…”

Section: Introductionmentioning

confidence: 99%

Structure Formation during Liquid-Phase Sintering of the Diamond-Containing Composites with Sn-Cu-Co-W Binders

Sokolov

2018

SSP

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“…Moreover, the binder has to be heat-resistant, as the work of diamond abrasive tools is associated with significant heating. Such a complex of properties can be obtained by sintering Co-Sn-Cu powder materials [3][4][5][6]. Depending on the method of forming and on the proportion of components, the mechanisms of sintering may be quite different [1,6].…”

Section: Introductionmentioning

confidence: 99%

Interaction of Components of Co-Sn and Co-Sn-Cu Powder Materials in Liquid Phase Sintering

Sokolov

Ozolin

Svistun

et al. 2019

MSF

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The interaction of components and structure formation were studied in liquid phase sintering of Co-Sn and Co-Sn-Cu powder materials. The powders of commercially pure metals were mixed with an organic binder and applied on the steel substrate. Sintering was performed under vacuum at temperatures of 820 and 1100 °C. The structure of sintered alloys was investigated by X-ray diffractometry and electron probe microanalysis, and microhardness (HV0.01) of the structural components was measured. It has been found that the nature of interaction of the liquid tin with the solid phase at the initial stage of sintering affects the formation of structure and porosity of Co-Sn and Co-Sn-Cu alloys considerably. In Co-Sn alloys, diffusion of tin into cobalt particles leads to the formation of intermetallic compounds, which hinders spreading of the liquid phase. This results in a porous defect structure formed in Co-Sn alloys. In Co-Sn-Cu alloys, at the initial stage of sintering the liquid phase enriched with copper is formed that wets the cobalt particles and contributes to their regrouping. As a result of this, materials with minor porosity are formed.

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The influence of temperature on interaction of Sn–Cu–Co–W binders with diamond in sintering the diamond-containing composite materials

Sokolov

Ozolin

2018

Materials Today: Proceedings

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Study of the Interaction between Composite Solders and Diamond

Cited by 5 publications

References 3 publications

Structure Formation during Liquid-Phase Sintering of the Diamond-Containing Composites with Sn-Cu-Co-W Binders

Structure Formation during Liquid-Phase Sintering of the Diamond-Containing Composites with Sn-Cu-Co-W Binders

Interaction of Components of Co-Sn and Co-Sn-Cu Powder Materials in Liquid Phase Sintering

The influence of temperature on interaction of Sn–Cu–Co–W binders with diamond in sintering the diamond-containing composite materials

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