Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer

Li, Gengzhuo; Xiao, Chen; Zhang, Shibo; Luo, Shusheng; Chen, Yuhan; Wu, Yongbo

doi:10.1016/j.triboint.2022.108087

Cited by 20 publications

(2 citation statements)

References 40 publications

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“…Furthermore, the bond energy of the Ce–O bond is greater than that of the Si–O bond, and the –OH adsorption and strain shear stress at the friction interface had weakened the activation energy belonging to the Si–Si bonds, which promoted the breaking of the Si–Si bonds in Si–Si–O–Ce on the substrate. 54,55 The new Si atoms were exposed, as depicted in Fig. 11(c).…”

Section: Resultsmentioning

confidence: 99%

Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

Cui

Zhang

et al. 2023

Nanoscale

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Section: Resultsmentioning

confidence: 99%

Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

Cui

Zhang

et al. 2023

Nanoscale

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show abstract

“…It was first developed by IBM for the production of a 64 MB DRAM. It then progressed rapidly and was widely applied in the manufacture of the first generation of semiconductor single-crystal silicon [244,245]. This technology was originally called chemical mechanical planarization because that was the purpose why it was invented.…”

Section: Chemical-assisted Polishingmentioning

confidence: 99%

Nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community: a comparative analysis

Zhao,

Ding

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-cut materials such as titanium alloys, high-temperature alloys, metal/ceramic/polymer-matrix composites, hard and brittle materials, as well as geometrically complex components such as thin-walled structures, micro channels and complex surfaces, are widely used in aerospace community. Mechanical machining is the main material removal process and responsible for the vast majority of material removal for aerospace components. Nevertheless, it encounters many problems in terms of severe and rapid tool wear, low machining efficiency, and deteriorated surface integrity. Nontraditional energy-assisted mechanical machining is a hybrid process in which nontraditional energies, e.g., vibration, laser, electric, etc., are applied to improve the machinability of local material and decrease burden of mechanical machining. It provides a feasible and promising way for improving machinability and surface quality, reducing process forces, and prolonging tool life, etc. However, systematic reviews of this technology are lacking with respect to the current research status and development direction. This paper reviews recent progress in nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community. It focuses on the processing principles, material responses under nontraditional energy, resultant forces and temperatures, material removal mechanisms and applications of these processes including vibration-, laser-, electric-, magnetic-, chemical-, cryogenic cooling-, and hybrid nontraditional energies-assisted mechanical machining. Eventually, a comprehensive summary of the principles, advantages and limitations for each hybrid process is provided, and future perspectives on forward design, device development and sustainability of nontraditional energy-assisted mechanical machining processes are discussed.

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Influence of Fenton-like reactions between hydrogen peroxide and ferric chloride on chemical mechanical polishing 304 stainless steel

Chen,

Peng,

Wang

et al. 2023

Int J Adv Manuf Technol

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Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer

Cited by 20 publications

References 40 publications

Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

Nontraditional energy-assisted mechanical machining of difficult-to-cut materials and components in aerospace community: a comparative analysis

Influence of Fenton-like reactions between hydrogen peroxide and ferric chloride on chemical mechanical polishing 304 stainless steel

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