Study of the dynamics of material removal processes in combined pulse laser drilling of alumina ceramic

Jia, Xianshi; Zhou, Li; Li, Kai; Zhang, Lu; Duan, Jian

doi:10.1016/j.optlastec.2022.109053

Cited by 28 publications

(12 citation statements)

References 45 publications

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“…When the pulse duration is shorter than the heat diffusion time, the irradiated volume of the material is expelled before heat diffusion or thermal damage can occur. Consequently, the side effects of thermal deformation are significantly reduced as compared to longer pulses [19][20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Picosecond laser drilling grids in aluminium foil at 532 and 355 nm wavelengths

Tojinazarov,

Sobirov,

Ibragimova

et al. 2024

Eng. Res. Express

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Ultra-short laser drilling technique enables production of filters, membranes, microfluidic, photonic, and biomedical devices. Micro-hole grids were drilled in aluminum foil using a 28 picosecond Nd:YAG laser operated at wavelength of 532 and 355 nm with energy up to 18 and 12 mJ, respectively. Varying pulse energy and number, micro-holes obtained at 355 nm and 3.6-9 mJ had the appropriate mean diameter of 36-86 μm. However, the circularity changed in 0.5-0.94. For the 2nd harmonic the mean diameter varied 15-61 μm at 0.36-9 mJ with the circularity of 0.81-0.92. The morphology of the area surrounding micro-holes investigated by scanning electron microscopy exhibited distribution of droplets dominated size 0.9-10 μm , which is feasible for filtration of contaminated liquids. Local elemental composition of the area determined by energy dispersive spectroscopy discovered significant increase in the concentration of C and O, and also emergency of F, depending on laser fluence under vapor-dominated ablation mode, where nuclear reactions are excited in hot plasma.

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Section: Introductionmentioning

confidence: 99%

Picosecond laser drilling grids in aluminium foil at 532 and 355 nm wavelengths

Tojinazarov,

Sobirov,

Ibragimova

et al. 2024

Eng. Res. Express

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“…With the advantages of precision features, ultra-smooth surface finish and mass production capability, the LIGA technique has emerged as the suitable method for large-scale fabrication of micro-devices, such as microfluidic chips, [1][2][3] micro-molds, 4,5 and optical systems. 6,7 As one of the major steps in LIGA, micro-electroforming has the ability to accurately replicate patterned micro molds through the deposition of metal atoms and consequently plays an increasingly important role in the manufacture of mold inserts. 8 However, the electroforming of high-aspect-ratio micro structures is still a challenging task.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays

Jiang

Dong

et al. 2023

Phys. Chem. Chem. Phys.

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“…The trend towards miniaturized high-performance electronic components driven by increasing demands on their functionality requires a high-density electronic packaging and interconnection technology. Hence, laser drilling has been intensively studied for various materials used in interconnect devices, such as, e.g., ceramics or different printed circuit board (PCB) materials [1][2][3][4][5][6]. In particular, ultrashort pulsed (USP) laser percussion drilling has been established for the fabrication of blind vias, so-called microvias, to inner conductive layers in multi-composite PCB material [5][6][7][8] with small diameters of <10 μm [9,10].…”

Section: Introductionmentioning

confidence: 99%

Picosecond laser microvia drilling of ABF material using MHz burst mode

Franz,

Häfner,

Bischoff

et al. 2023

Mater. Res. Express

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We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication.

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Study of the dynamics of material removal processes in combined pulse laser drilling of alumina ceramic

Cited by 28 publications

References 45 publications

Picosecond laser drilling grids in aluminium foil at 532 and 355 nm wavelengths

Picosecond laser drilling grids in aluminium foil at 532 and 355 nm wavelengths

Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays

Picosecond laser microvia drilling of ABF material using MHz burst mode

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