2003
DOI: 10.1002/crat.200310037
|View full text |Cite
|
Sign up to set email alerts
|

Study of surface morphology of electrochemically etched n‐Si (111) electrodes at different anodic potentials

Abstract: Changes of n-Si (111) silicon surface morphology after anodisation at different voltage conditions in dilute NH 4 F solutions were studied by AFM technique. The electrochemical etching was done with respect to current-voltage (I-V) characteristics. The Si surface was investigated at increasing and constant voltage conditions. The porous silicon was formed at potentials slightly anodic from the rest potential (from -0.6 V to 0.02 V). On the other hand silicon oxide formation and electropolishing occurs at highe… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
9
0

Year Published

2005
2005
2012
2012

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 17 publications
(11 citation statements)
references
References 24 publications
(32 reference statements)
0
9
0
Order By: Relevance
“…In this case, the Si-SiF bonds can be broken by reacting with H 2 O, resulting in Si-O-Si bonds, which are not stable in HF. The resulting measured current is then oscillating for a fixed applied voltage [15]. In aqueous electrolytes, derived from the H 2 O-HF system, the limit between these two regions is materialized by a bPorous Silicon Limit (PSL)-peakQ clearly observed in Fig.…”
Section: Current Density Measurementsmentioning
confidence: 99%
“…In this case, the Si-SiF bonds can be broken by reacting with H 2 O, resulting in Si-O-Si bonds, which are not stable in HF. The resulting measured current is then oscillating for a fixed applied voltage [15]. In aqueous electrolytes, derived from the H 2 O-HF system, the limit between these two regions is materialized by a bPorous Silicon Limit (PSL)-peakQ clearly observed in Fig.…”
Section: Current Density Measurementsmentioning
confidence: 99%
“…Accordingly, during one cycle such a Si-layer is removed by oxidation and subsequently oxide etching [16]. The thickness of the removed Si-layer depends on potential, illumination and etching rate.…”
Section: Morphological Aspectsmentioning
confidence: 99%
“…Simultaneously, the current-less etching process reduces the oxide thickness until a minimum value is reached at which electrical contact between electrolyte and silicon is made locally and the cycle starts again. During each cycle, a silicon layer of constant thickness d is consumed by oxidation and dissolution (15). The oxide thickness oscillation, however, proceeds not uniformly at the whole electrode surface.…”
Section: The Morphological Modelmentioning
confidence: 99%