2015
DOI: 10.1007/s11663-015-0367-1
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Study of Solidification and Heat Transfer Behavior of Mold Flux Through Mold Flux Heat Transfer Simulator Technique: Part II. Effect of Mold Oscillation on Heat Transfer Behaviors

Abstract: Mold flux solidification and heat transfer experiments under both non-oscillation and oscillation modes have been conducted and compared with the help of Mold Flux Heat Transfer Simulator (MFHTS) technique. The results suggested that the steady-state responding heat flux in the mode of oscillation is smaller than that in non-oscillation operation, and a transition time is observed in the responding temperature and heat flux profiles during the oscillation experiments. The oscillation of mold would introduce th… Show more

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Cited by 13 publications
(11 citation statements)
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“…[52][53][54][55] However, all above techniques for the measurement of thermal resistance cannot represent the real scenario of continuous casting mold where the mold/slag thermal resistance varies with the position below the meniscus. A pilot caster [2,56] had been used to investigate the heat transfer across the slag film, while the thermal resistance of slag film along the casting direction was difficult to be calculated due to the complex and transient heat transfer in the vicinity of the meniscus.…”
Section: Previous Workmentioning
confidence: 99%
“…[52][53][54][55] However, all above techniques for the measurement of thermal resistance cannot represent the real scenario of continuous casting mold where the mold/slag thermal resistance varies with the position below the meniscus. A pilot caster [2,56] had been used to investigate the heat transfer across the slag film, while the thermal resistance of slag film along the casting direction was difficult to be calculated due to the complex and transient heat transfer in the vicinity of the meniscus.…”
Section: Previous Workmentioning
confidence: 99%
“…[19] In experiments where the finger included oscillation, the estimated interfacial thermal resistance reached slightly higher values, up tõ 2.25 9 10 À3 m 2 K/W. [9] Apparently, oscillation of the mold caused a rougher surface of the slag layer in contact with the copper finger. An experimental apparatus for simulating the initial solidification of a low-carbon steel produced a slag film, between the mold and the shell, with thickness in the range of 1.4 to 2.4 mm.…”
Section: Introductionmentioning
confidence: 97%
“…[5,6] Through the liquid and solid layers, heat is transferred by conduction and radiation and reaches the mold by conduction through an air gap that is claimed to form between the solid layer and the mold. [7][8][9] Normally, it is stated that the gap arises because the crystalline phase has a higher density than the glass, and therefore crystallization results in shrinkage of the solid flux layer. [10,11] In an investigation carried out to determine the surface roughness of solidified mold fluxes, it was found that this was in the range of 10 to 30 lm, when the crystalline phase precipitated; [12] this surface roughness was claimed to agree with the calculated thickness of the air gap assumed to form between the mold and the solidified slag layer.…”
Section: Introductionmentioning
confidence: 99%
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