Abstract:As one of two mainstream platforms, photonics integrated circuits (PICs) on Si photonics platform benefits from the mature complementary metal-oxide-semiconductor (CMOS) manufacturing capabilities and allows for the processing of Si-based PICs with ultra-high volume and low cost. Recent studies of SiGeSn materials, which yield true direct bandgap with sufficient Sn incorporation, hold great promise for PICs featuring scalable, cost-effective, and power-efficient. While the exciting developments in bulk devices… Show more
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