Study of Self Cross-Link Bottom Antireflective Coating and Gap Fill Materials for Sublimate Defect Reduction in ArF Lithography

Abstract

Sublimate reduction from the new bottom antireflective coating (BARC) and gap fill materials in bake process was investigated by means of absorption spectroscopy and the quantitative analysis of sublimation using the quartz crystal microbalance (QCM) sensing element. The small molecular components in BARC and gap fill materials were found to be related to a decrease in the number of sublimate defect. The application of the newly developed BARC and gap fill materials of the polymers with a self cross-link reaction system showed lower sublimate amount. In addition, good resist profiles and 130 nm via fill performance in the via-first dual damascene process were achieved using this self cross-link polymer system. This new system is one of the most promising systems ready to be tested for the mass production of 32 -45 nm node IC devices and beyond.

Step and Flash Nano Imprint Lithography of 80 nm Dense Line Pattern Using Trehalose Derivative Resist Material

“…A stripping test result of less than 10 nm was considered acceptable. [17][18][19][20] The stripping test showed no detectable changes (less than 1.0 nm) in 300 nm film thickness of NCI-NIL-R01 and 100 nm film thickness of NCI-NIL-U01, indicating that NCI-NIL-R01 and NCI-NIL-U01 do not interact significantly. It was obvious that these materials were crosslinked in terms of resistance.…”

Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode

“…However, the thermal crosslink materials included crosslinker, catalyst, and additives with lower molecular weight were difficult to achieve more sublimate reduction from these materials. This is because sublimate crosslinker agents, catalyst and dyes have lower molecular weight partly compared with polymer binders in bake process 11 . The developed light-scattering thermal cross-linking package film based on self-assembly was designed by using a suitable molecular weight to avoid sublimation, defect and a crosslink reaction system in this study.…”

Nanomorphology of Polymer Blends for a Light-Scattering Thermosetting Plate Based on Self-Assembly

“…Conversely, traditional thermosetting materials such as negative photoresist, paint, ink, and optical plates consist of polymer binders, cross‐linker, catalyst, and additives that are either attached or blended with the polymer. However, it is difficult to achieve greater reduction using the current thermal cross‐linking materials, e.g., cross‐linker, catalyst, and additives, because of their low molecular weights compared with those of the polymer binders in the bake process …”