1995
DOI: 10.1063/1.114327
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Study of Schottky barriers on n-type GaN grown by low-pressure metalorganic chemical vapor deposition

Abstract: Schottky barriers on n-type GaN films grown by low-pressure metalorganic chemical vapor deposition are characterized and derived. A thin Pt or a Pd layer is deposited by electron-gun evaporation to form Schottky contacts in a vacuum below 1×10−6 Torr. The Schottky barrier heights of Pt on the n-GaN film are determined to be 1.04 and 1.03 eV by current–voltage (C–V) and current density–temperature (J–T) measurements, respectively. Also based on C–V and J–T measurements, the measured barrier height of Pd on n-Ga… Show more

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Cited by 144 publications
(67 citation statements)
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“…Therefore, these values are characteristic not only of uniform but also of ideal α-GaN Schottky contacts. Figure 3 also displays the experimental data published by Khan et al [9], Binary et al [10], and Guo et al [11]. These data also confirm the predictions of the MIGS-and-electronegativity model.…”
Section: Discussionsupporting
confidence: 78%
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“…Therefore, these values are characteristic not only of uniform but also of ideal α-GaN Schottky contacts. Figure 3 also displays the experimental data published by Khan et al [9], Binary et al [10], and Guo et al [11]. These data also confirm the predictions of the MIGS-and-electronegativity model.…”
Section: Discussionsupporting
confidence: 78%
“…and = 2.35 eV for cubic ß-GaN. However, the barrier heights reported here and by others [9] [10] [11] were all obtained with wurtzite rather than zincblende GaN. SiC is another example for such polytypism.…”
Section: Discussionmentioning
confidence: 45%
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“…Precise and reliable control of the depletion layer width by the Schottky contact without leakage currents is extremely important in these devices. However, GaN-based Schottky interfaces are known to suffer from unusually large leakage currents under reverse bias [1][2][3]. Excess leakage currents through a Schottky gate strongly affects, not only gate-control and power consumption, but also the noise performance in GaN-based FET devices as recently pointed out [4].…”
Section: Introductionmentioning
confidence: 99%
“…5,6 However, the plasma-induced defects and surface residues that remain after such processes limit their use in the fabrication of highly reliable devices 7,8 as they tend to degrade the optical 9 and electrical properties (e.g., as exhibited by an increase in leakage current and a decrease in breakdown voltage of diodes). 10,11 Therefore, there is a strong demand to develop post-etching processes that eliminate such defects and residues.…”
mentioning
confidence: 99%