Study of ${\rm Nb}_{3}{\rm Al}$ Wires for High-Field Accelerator Magnet Applications

Tsuchiya, K.; Takeuchi, T.; Banno, N.; Kikuchi, A.; Iijima, Y.; Nimori, Shigeki; Takigawa, H.; Terashima, A.; Yamamoto, A.; Kuroda, Yosuke; Takao, T.; Tagawa, K.; Tanaka, Kazuhide; Nakagawa, Kouji

doi:10.1109/tasc.2010.2042699

Cited by 15 publications

(5 citation statements)

References 5 publications

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“…Since rapid-heating, quenching and transformation annealing (RHQT)-processed Nb 3 Al superconducting wires [1,2] exhibit higher tolerances to very large electromagnetic forces and mechanical strains than Nb 3 Sn superconducting wires [3][4][5][6], they have been developed for use in nuclear fusion reactors [7,8] and magnets for high-energy particle accelerators [9,10]. Conventional precursor wires, which were mainly developed for nuclear magnetic resonance magnets, consist of several jelly-roll (JR) Nb/Al filaments embedded in a Nb matrix [11,12].…”

Section: Introductionmentioning

confidence: 99%

A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

Takeuchi

Tsuchiya

Nakagawa

et al. 2012

Supercond. Sci. Technol.

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To suppress the low-magnetic-field instability (flux jumps in low magnetic fields) of a rapid-heating, quenching and transformation (RHQT) processed Nb 3 Al superconductor, we had previously modified the cross-sectional design of an RHQT Nb 3 Al by adopting a Ta filament-barrier structure. Unlike Nb barriers, Ta barriers are not superconducting in magnetic fields at 4.2 K so that they electromagnetically decouple filaments. However, small flux jumps still occurred at 1.8 K, which is a typical operating temperature for the magnets used in high-energy particle accelerators. Furthermore, poor bonding at the Ta/Ta interface between neighboring Ta-coated jelly-roll (JR) filaments frequently caused precursor wires to break during drawing. To overcome these problems, we fabricated a new RHQT Nb 3 Al wire with a Ta/Cu/Ta three-layer filament-barrier structure for which an internal stabilization technique (Cu rods encased in Ta are dispersed in the wire cross section) was extended. Removing the Ta/Ta interface in the interfilamentary barrier (JR filament/Ta/Cu/Ta/JR filament) allowed precursor wires to be drawn without breaking. Furthermore, the Cu filament barrier electromagnetically decoupled filaments to suppress flux jumps at 1.8 K. The ductile Cu layer also improved the bending strain tolerance of RHQT Nb 3 Al.

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Section: Introductionmentioning

confidence: 99%

A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

Takeuchi

Tsuchiya

Nakagawa

et al. 2012

Supercond. Sci. Technol.

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“…Some of the structural applications of IMCs are mentioned in Table 2 . [ 20–28 ] The high‐temperature strength is the common property of almost all IMCs, but due to the large gap in electronegativity and crystal structure, most of the IMCs are brittle in nature. It has been demonstrated that by adding proper alloying elements to various IMCs, such as, Fe 3 Al, Ni 3 Al, FeAl, etc., their room temperature ductility can be increased.…”

Section: Crystal Structures Of Intermetallic Compoundsmentioning

confidence: 99%

A Critical Review on the Properties of Intermetallic Compounds and Their Application in the Modern Manufacturing

Paul

Mukherjee

Singh

2021

Crystal Research and Technology

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Advancement in modern manufacturing processes is allowing researchers to develop new alloy configurations for different applications to reduce weight and increase efficiency. Many alloy combinations are produced that randomly generate different phases of intermetallic compounds (IMCs) in the structure during manufacturing which show unique mechanical and chemical properties. But, the fundamental knowledge of different IMCs is scattered across the material research domain. Thus, in this review, the crystal structures of IMCs are thoroughly discussed which are having structural and functional applications. Furthermore, the issues associated with the dissimilar Fe‐Al, Fe‐Ni, and Ni‐Al systems via modern manufacturing processes such as arc additive manufacturing have been discussed. Moreover, detailed knowledge of ferro‐nickel, nickel‐aluminides, and ferro‐aluminides formed at the interface during the dissimilar deposition in modern manufacturing is provided. Currently, a few transition metal IMCs and some Heusler alloys, are the most promising and are used in applications. The addition of a third alloying element provides the broadening effect on the phase domain of a specific IMC. Furthermore, it has been observed that modern manufacturing processes such as additive manufacturing and others are new and advanced manufacturing technologies used for dissimilar metal deposition, which can control the IMCs in a more favorable direction.

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“…Primary factors enabling us to control the Nb 3 Al phase formation are the followings: (a) composition, (b) RHQ condition (input power), (c) transformation condition (temperature [7]. Influence of the Al layer thickness on critical current density J c was also discussed in a previous paper [8]. However, the characteristics have not been optimized, fully considering the difference of RHQ condition and the deformation degree prior to the transformation process as well as the Al layer thickness.…”

Section: Introductionmentioning

confidence: 99%

Influence of Al Composition Thickness on Critical Current Density in Transformation-Processed <inline-formula> <tex-math notation="TeX">$\hbox{Nb}_{3}\hbox{Al}$</tex-math></inline-formula> Superconductors

Banno

Tsuchiya

Nakamoto

et al. 2015

IEEE Trans. Appl. Supercond.

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The influence of the Al layer thickness on the critical current density J c of transformation-processed Nb 3 Al superconductors was investigated. The Al layer thickness in the jerry-roll filaments of precursor wires was varied from 120 to 250 nm; the Nb layer thickness is proportional to the Al thickness, keeping the Nb-Al composition ratio to 3. The rapid heating and quenching (RHQ) operation condition was varied within a range of the conditions to form the ductile body-centered cubic (BCC) Nb-Al phase. The RHQ wires were also followed by an areal reduction process prior to the Nb 3 Al phase transformation. Thinner Al thickness wires show a steeper increase in J c with reduction in the area, whereas thicker Al thickness wires show a slower increase. The best J c performance was obtained for the thinnest Al thickness sample. Without areal reduction, there was not much difference in the optimum J c with respect to the Al thickness.Index Terms-Al layer thickness, J c characteristics, Nb 3 Al, phase transformation, rapid-heating and quenching (RHQ).

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Study of ${\rm Nb}_{3}{\rm Al}$ Wires for High-Field Accelerator Magnet Applications

Cited by 15 publications

References 5 publications

A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

A Critical Review on the Properties of Intermetallic Compounds and Their Application in the Modern Manufacturing

Influence of Al Composition Thickness on Critical Current Density in Transformation-Processed <inline-formula> <tex-math notation="TeX">$\hbox{Nb}_{3}\hbox{Al}$</tex-math></inline-formula> Superconductors

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Study of ${\rm Nb}_{3}{\rm Al}$ Wires for High-Field Accelerator Magnet Applications

Cited by 15 publications

References 5 publications

A new RHQT Nb3Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

A new RHQT Nb3Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

A Critical Review on the Properties of Intermetallic Compounds and Their Application in the Modern Manufacturing

Influence of Al Composition Thickness on Critical Current Density in Transformation-Processed <inline-formula> <tex-math notation="TeX">$\hbox{Nb}_{3}\hbox{Al}$</tex-math></inline-formula> Superconductors

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A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure

A new RHQT Nb₃Al superconducting wire with a Ta/Cu/Ta three-layer filament-barrier structure