Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation

Abstract

The comparison of one- and three-dimensional cure simulation of thick thermoset matrix laminates was conducted in this study. The applicable conditions of one-dimensional cure simulation were investigated. The transient heat conduction equation coupled to the cure kinetics was solved numerically using one- and three-dimensional finite element analysis. The evolution of temperature and degree of cure of the laminates during the curing process obtained by the simulation agreed well with the published experimental results. The results indicate that a wider one-dimensional analysis applicable region around the center point will be obtained in the laminate with a higher span-to-thickness ratio and in a less anisotropic material system. In the applicable region, the accuracy of the one-dimensional cure simulation can satisfy the engineering request and save the computational cost. While beyond the region, there is a steep increase in deviation of the one- and three-dimensional simulation results.

Development and verification of a cure-dependent visco-thermo-elastic simulation model for predicting the process-induced surface waviness of continuous fiber reinforced thermosets

“…Assuming a generic temperature cycle that is imposed on all nodes, the thermal shrinkage may be underestimated by the model due to the exclusion of temporary temperature increases by the heat generated as a consequence of the exothermal curing reaction. Since this most likely occurs at higher curing temperatures (and thus higher reaction rates δξδt, the generated specific heat q˙∼HRδξδt, where HR represents the total reaction enthalpy 64 ), this may cause deviations at a temperature of 120°C. Also, the underlying numerical model considers no plasticity and damage of resin and fiber-matrix-interface which may result in a divergence between the numerical and the experimental data.

Figure 12.Transmitted light photographic images of the manufactured components.

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Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

“…The shrinkage strain produced by the chemical reaction can be obtained from the volume change rate which is related to the curing degree. And the chemical shrinkage strain during curing can be described as Equation (13) [32].…”

“…The shrinkage strain produced by the chemical reaction can be obtained from the volume change rate which is related to the curing degree. And the chemical shrinkage strain during curing can be described as Equation () [32]. $$${\varepsilon }_{\text{ch}}(\alpha )=1-\sqrt[3]{1-{V}_{\text{ch}}\left(\alpha -{\alpha }_{\text{gel}}\right)}$$$ where ε ch is the chemical shrinkage strain, and the volume shrinkage V ch is −0.02.…”

Virtual manufacturing of thick composite beams, investigating cure cycle and shrinkage induced stress

“…Similarly, Guo et al used a one-dimensional numerical model and found that conventional cure cycles should be modified for thick laminates [16]. Ren et al showed that a one-dimensional model can give valid predictions for laminates with a high span-to-thickness ratio (e.g., thin laminates) [17]. Limitations of one-dimensional models resulted in the need for accurate threedimensional models.…”