Abstract:The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor cham… Show more
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