Study of low-temperature direct bonding of (111) and (100) silicon wafers under various ambient and surface conditions

Resnik, D.; Vrtačnik, D.; Aljancic, U.; Amon, S.

doi:10.1016/s0924-4247(99)00299-x

Cited by 19 publications

(15 citation statements)

References 29 publications

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“…The presence of any dielectric layer (SiO 2 ) on the silicon substrate may require a higher applied voltage. 93 Glass/glass anodic bonding can also be carried out using Ti (80 nm thick) as a metallic intermediate layer. 94 The bonding connections reported for this work were a temperature of 530 C and an applied voltage of 100 V; Corning 0021 microscope slides were used.…”

Section: Anodic Bondingmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

302

207

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This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow. I. WHY USE SILICON AND GLASS IN MICRO-AND NANO-FLUIDIC APPLICATIONS?Micro-and nano-fluidic technology continues to be embraced by biologists, 1-3 chemists, 4 and engineers throughout academia and industry. As its applications have expanded, there has been an explosion in the range of materials and processes used to fabricate these devices. The earliest microfluidic devices (e.g., gas 5 and liquid 6 chromatography devices) were made from silicon and glass and borrowed processes directly from semiconductor and microelectromechanical systems (MEMS) manufacturing. 7 Now, however, many researchers have moved away from silicon and glass, and instead use cast elastomers such as polydimethylsiloxane (PDMS)-which is ideal for swift prototyping-or thermoplastic polymers, which can be hot-embossed or injection-molded and are well suited to inexpensive manufacturing. Yet, there remain many applications where glass and silicon offer advantages over polymeric materials. In this paper, we highlight these advantages and offer a framework for selecting fabrication processes when using silicon and glass. A. The dominance of soft lithographyOver the last decade, PDMS has become virtually the default material for forming microfluidic devices, 8 because of the sheer ease with which it can be cast on to a micro-scale mould and then strongly bonded to glass. 9 The elastomeric nature of the material has been exploited to integrate fluidic valves and pumps on-chip and has simplified the production of multi-layer devices because the soft layers readily conform to each other. 10,11 Yet, the low stiffness (usually <1 MPa) of PDMS relative to amorphous thermoplastics, silicon, and glass has its own a) Authors to whom correspondence should be addressed. Electronic addresses: ciliescu@ibn.a-star.edu.sg and hkt@ntu.edu.sg. 6, 016505 (2012) drawbacks. High aspect-ratio channels are notoriously difficult to fabricate in PDMS because of their propensity to collapse. 12 Moreover, difficulties in automating the handling of such a soft material have hampered efforts to scale up PDMS device manufacturing. Meanwhile, PDMS's high oxygen and water permeabilities have proved both a blessing and a curse in different applications.The hydrophobic nature of PDMS can be an important consideration for some biological applications. In drug screening applications, for example, hydrophobic drugs as well as metabolites (urea or albumin) can be absorbed into the device's material due to hydrophobic--hydrophobic interaction...

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Section: Anodic Bondingmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

302

207

View full text Add to dashboard Cite

show abstract

“…Then, after substituting (16) into (14), we have (19) In a heated vacuum chamber, the water concentration is extremely low, i.e., and ; hence, we have the boundary conditions as follows:…”

Section: B Development Of Diffusion Modelmentioning

confidence: 99%

“…Now, let us look back at (16). The value of the constant " " can be determined by treating it as a fitting parameter of (19) when comparing its computation results with the experimental data. The experimental data for bonding at various temperatures annealed for four hours are used for the comparison.…”

Section: Determination Of Parameters' Valuesmentioning

confidence: 99%

“…Now that the values of all the parameters needed are known, as shown in Table II, (19) can be solved using the boundary conditions in (20) to (22). Then, using (40), the change of with time can be obtained.…”

Section: Determination Of Parameters' Valuesmentioning

confidence: 99%

“…Resnik et al found that wafers in the (111) orientation exhibited higher bonding abilities compared to (100) in case of bonding wafers with native oxides [19]. This was believed to be due to the higher density of available bonding sites as a consequence of enhanced chemical oxide growth rate and its homogeneity on (111) surface.…”

Section: Effect Of Wafer Orientationmentioning

confidence: 99%

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Mathematical model of low-temperature wafer bonding under medium vacuum and its application

Wei

Tan

et al. 2005

IEEE Trans. Adv. Packag.

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Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO 2 and the diffusion theory in porous media. It is found that the model agrees well with the experimental data. This model can be applied to predict the effects of annealing time, annealing temperature, ambient vacuum, wafer orientation, and wafer dimension on the bond strength. Index Terms-Bond strength, bonding mechanisms, diffusion theory, mathematical model, wafer bonding.

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Microreactors Made of Glass and Silicon

Frank¹

2013

Microreactors in Organic Chemistry and Catalysis

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Study of low-temperature direct bonding of (111) and (100) silicon wafers under various ambient and surface conditions

Cited by 19 publications

References 29 publications

A practical guide for the fabrication of microfluidic devices using glass and silicon

A practical guide for the fabrication of microfluidic devices using glass and silicon

Mathematical model of low-temperature wafer bonding under medium vacuum and its application

Microreactors Made of Glass and Silicon

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