Study of flow and heat transfer characteristics and LIGA fabrication of microspinnerets

Tzeng, Sheng‐Chung; P, W

doi:10.1088/0960-1317/13/5/319

Cited by 12 publications

(6 citation statements)

References 14 publications

(20 reference statements)

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“…Recently, various new technologies and tools such as LIGA, micro machining, thin film technology, etching technology and atomic force microscopes have been used for microfabrication processes to develop innovative new products or to increase the manufacturing capacity and the performance of component parts. In particular, LIGA-like technology has been widely used for many applications such as micro actuators, micro sensors [1], micro motors [2], micro flow channels [3], micro component parts [4][5][6][7][8][9][10][11] and micro molds [12,13].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of micro nickel/diamond abrasive pellet array lapping tools using a LIGA-like technology

Luo¹,

Yu²,

Hu³

2007

J. Micromech. Microeng.

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A manufacturing process of micro nickel/diamond abrasive pellet array lapping tools using a LIGA-like technology is reported here. The thickness of JSR THB-151N resist coated on an aluminum alloy substrate for micro lithography can reach up to 110 µm. During the lithography, different geometrical photomasks were used to create specific design patterns of the resist mold on the substrate. Micro roots, made by electrolytic machining on the substrate with guidance of the resist mold, can improve the adhesion of micro nickel abrasive pellets electroplated on the substrate. During the composite electroforming, the desired hardness of the nickel matrix inside the micro diamond abrasive pellets can be obtained by the addition of leveling and stress reducing agents. At moderate blade agitation and ultrasonic oscillation, higher concentration and more uniform dispersion of diamond powders deposited in the nickel matrix can be achieved. With these optimal experiment conditions of this fabrication process, the production of micro nickel/diamond abrasive pellet array lapping tools is demonstrated.

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Section: Introductionmentioning

confidence: 99%

Fabrication of micro nickel/diamond abrasive pellet array lapping tools using a LIGA-like technology

Luo¹,

Yu²,

Hu³

2007

J. Micromech. Microeng.

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“…It is desirable that the jet heater be disposed on the chip at a location as close as possible to the channels themselves for a most accurate reading of the actual temperature of the liquid ink just before a given ejector is fired. At the same time, the location of the jet heater must be rigorous designed because an additional requirement of a experiential bubble jet printhead is that the chip be as small as physically possible, yet still contain all the circuits required for valid operation [11][12][13][14][15][16]. The DNA droplet ejection of our addressing N bits jets elements switch multiplexer circuit system printhead has been measured of ejected DNA droplet behavior.…”

Section: Introductionmentioning

confidence: 99%

Design and Fabrication of Printed DNA Droplets Arrangement and Detection Inkjet System

Liou¹

2016

Printed Electronics - Current Trends and Applications

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This article describes the aims to establish a thermal bubble printhead with simultaneously driving multi-channel for DNA droplet arrangement. It proposed a monolithic CMOS/MEMS system with multi-level output voltage ESD protection system for protected inkjet printhead. High-voltage power, low-voltage logic, and CMOS/MEMS architecture were integrated in inkjet chip. It used bulk micromachining technology (MEMS). On-chip high-voltage electrostatic discharge (HV-ESD), protection design in smart power technology of monolithic inkjet chip is a challenging issue. The nozzle jets interleaving scanning sequence is controlled spatially on the elements to avoid the strong interference with DNA droplets caused by the excitation of the neighbor driven elements. A heating element, disposed on the substrate, includes a conductor loop which does not encompass the heating elements on the substrate. The configuration of the heater jet significantly reduces both electromagnetic and capacitance interference caused by the heating elements. The simulation and experience result have shown in the research. It is reduced nearly half the time compared to the case with traditional scanning sequence. This experiment develops new controlled structure designs of chip for inkjet printheads. A bubble inkjet(TIJ) device is designed, several of the architectures may be adjusted just a small microns to improve and optimize the DNA drop nucleation and generation efficiency. The DNA droplet ejection behavior of the multiplexer inkjet printhead within 60-μm orifice size has been measured beyond 5 kHz operation system, 12 pL capacity of ejected DNA droplet volume.

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“…In discardable print heads, which are thermal bubble-type print heads, the entire unit is discarded when the cartridge is out of ink. (6)(7)(8)(9)(10)(11)(12)(13)(14)(15) The principle used in these print heads is the same as that underlying the formation of water bubbles when water is boiled: during heating, (16)(17)(18)(19)(20)(21)(22)(23)(24)(25) when nucleation occurs, a local ink bubble is formed and the ink is extruded directly onto the paper. These inkjet printers are less expensive than those with permanent print heads.…”

Section: Introductionmentioning

confidence: 99%

Design and Fabrication of Identification Inkjet Print Head Chip Fuse Sensors

2016

Sensors and Materials

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This paper describes the development of a thermal inkjet print head with an identification circuit. The identification circuit was designed using a fuse and other electronic components. The multifunctionality of the integrated circuit in a print head of the cartridge was used to satisfy user demands. The circuit was encoded to enable identification of general information regarding the ink cartridge, such as its model number, serial number, color settings (color or gray scale), and the best print quality. In addition, the current status of the cartridge, such as whether its life has elapsed, can be identified. The identification circuit was connected in series with the metal oxide semiconductor (MOS) drain fuse after the wafer factory burn break fuse. A V ID of more than 3.6 V indicates a blown fuse. Therefore, the fuse-blow voltage was set to be 3.6 V. At a value of V GS equal to 15.5 V, blown fuse parameter analysis was performed. Linear regression showed that the I D current was 54.36 mA. X-ray diffraction patterns revealed that the X-rays penetrate the fuse circuit from the top. Therefore, the elemental composition of all layers, from the upper layer SiC/ SiN to the Si substrate, was analyzed and determined to be Si, C, N, Ta, Al, P, and O, among others. Because most layers contain Si, the Si peak was the largest. The fuse profile was characterized using scanning electron microscopy. Fuse size and current density were also investigated.

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Study of flow and heat transfer characteristics and LIGA fabrication of microspinnerets

Cited by 12 publications

References 14 publications

Fabrication of micro nickel/diamond abrasive pellet array lapping tools using a LIGA-like technology

Fabrication of micro nickel/diamond abrasive pellet array lapping tools using a LIGA-like technology

Design and Fabrication of Printed DNA Droplets Arrangement and Detection Inkjet System

Design and Fabrication of Identification Inkjet Print Head Chip Fuse Sensors

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