Study of factors affecting the hardness of ball bonds in copper wire bonding

Zhong, Zhang; Ho, Huey-Lin; Tan, Yee Chen; Tan, W.C.; Goh, H.M.; Toh, B.H.W.; Tan, Jiakun

doi:10.1016/j.mee.2006.11.003

Cited by 61 publications

(25 citation statements)

References 30 publications

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“…With the preliminary study of the mechanical properties, the silver indium solid solution phase is a promising candidate for interconnection applications in electronic industries. As interconnection medium, the lower hardness and yield stress would be desirable [20] since it induce less internal stress to the die or bonding pad underneath. With the superior ductility, forming of silver indium solid solution phase is better than that of pure silver, so that it is suitable for being forged into various forms of industrial products.…”

Section: Resultsmentioning

confidence: 99%

The growth and stress vs. strain characterization of the silver solid solution phase with indium

Huo

Lee

2016

Journal of Alloys and Compounds

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The growth and stress vs. strain characterization of the silver solid solution phase with indium Silver solid solution phase with indium has been discovered to have great mechanical properties and anti-tarnishing property, as shown in the results of our previous study. It is important to know the stress vs. strain curve before adopting this material in industrial applications. The growth of the homogeneous silver solid solution phase with indium is first described. The X-ray diffraction (XRD) patterns and scanning electron microscope/energy dispersive X-ray spectroscopy (SEM/EDX) results are reported to verify the chemical composition of silver solid solution phase with indium samples. Based on the results, one could reversely determine the indium element composition in (Ag)exxIn solid solution by examining the lattice constant value using XRD for unknown compositions. The preparation of ASTM tensile test samples and tensile test experimental setting are explained in details. The intrinsic mechanical material properties of silver solid solution phase with indium, i.e., characteristic stress vs. strain curves, are presented and analyzed, with pure silver stress vs. strain curve in comparison. According to the experimental results, silver solid solution phase with indium exhibits low yield strength, high ultimate tensile strength, and large elongation value before fracture, compared to pure silver. In addition, fractography of the fracture surface of the tested sample has been studied to confirm the superior ductility of silver solid solution phase with indium. These superior mechanical properties may bring silver solid solution phase with indium new applications in various industries such as electronics and brazing.

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Section: Resultsmentioning

confidence: 99%

The growth and stress vs. strain characterization of the silver solid solution phase with indium

Huo

Lee

2016

Journal of Alloys and Compounds

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“…In the semiconductor integration, packaging and manufacturing process, the relatively low hardness and yield strength are highly desirable material properties in the selection of interconnecting materials, because it induces less contact stress to the areas underneath bond pads on integrated circuit (IC) chips [53]. Lower yield strength can be beneficial to the rapid solid-state bonding process by allowing to achieve higher value of truly bonded fraction [54].…”

Section: Discussionmentioning

confidence: 99%

Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys

Huo

Lee

2018

Materials Science and Engineering: A

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“…Differences in grain orientation and local strain rate and strain/strain rate gradients contribute to the overall hardening of the ball. It is important however to note that process parameters affect the melting and recrystallization of the FAB and therefore the initial ball hardness and it is possible to get softer balls with copper wire by manipulation of the EFO firing time [62]. Subsequent hardening of balls during the bonding process still depends on the capillary geometry and the strain gradients developed during compression and it may be possible to optimize process and material parameters (including wire material) to minimize the hardening effect.…”

Section: Plastic Deformation Of Ball Bondsmentioning

confidence: 99%