Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

Koleňák, Roman; Hodúlová, Erika

doi:10.1007/s40194-017-0538-6

Cited by 4 publications

(4 citation statements)

References 23 publications

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“…Another field of our research was the study of the applicability of Bi-based solders. In work [30], we devoted ourselves to the study of direct soldering of Al 2 O 3 ceramics with Cu by application of Bi11Ag2La solder. Lanthanum was added to the solder as an active element to ensure the wetting of the Al 2 O 3 surface.…”

Section: Introductionmentioning

confidence: 99%

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

et al. 2023

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This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni–SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni–SiC joint with Bi11Ag1Mg solder is 27 MPa.

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Section: Introductionmentioning

confidence: 99%

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

et al. 2023

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“…Wetting may be achieved by metallization of the substrate surfaces prior to the joining process [11], but an alternative, frequently used approach is adding chemically active elements, most commonly Ti, Zr and Hf to the solder alloy [12][13][14][15]. Furthermore, the use of Mg [16][17][18], V [19,20], Ta [21,22], Cr [23], Nb [24] and rare earth elements such as La [25,26] and Lu [27] is also reported in the literature. Wetting with the aid of active elements is associated with their enrichment at the substrate/solder interface, reaction with the substrate and consequently the formation of a reaction phase layer [28][29][30][31].…”

Section: Introductionmentioning

confidence: 99%

“…The potential of Bi-Ag alloys as a substitute material for Pb-containing solders for high soft soldering temperature applications has been demonstrated by various authors [41][42][43][44][45][46][47][48][49][50][51]. Furthermore, Koleň ák et al [25] and Šuryová et al [52] showed the possibility of joining ceramics (Al 2 O 3 and SiC) with Cu using Bi-Ag-based alloys with small additions of La and Ti as active elements; these authors used ultrasound to enhance wetting during the soldering process. In the present study, Ti in combination with Mg were selected as reactive elements.…”

Section: Introductionmentioning

confidence: 99%

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

Weber

Rettenmayr

2020

J Mater Sci

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Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.

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“…%. Advantage of S-bond solders consist in the fact that the solder matrix has a sufficient elasticity reserve, by what it is capable to absorb partially the undesired residual stresses formed in the joint [8].…”

Section: Introductionmentioning

confidence: 99%

Research of Soldering Silicon Substrate with Solder Type Sn-Ag-Ti

Koleňák

Prach

2015

AMM

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The work deals with soldering of silicon substrate with active solders designated S-Bond 220-1, 220-50 and 220-M. Soldering was performed with power ultrasound in the air without flux application at temperature 250 to 280 °C. The results of EDX analysis have shown that active elements as Ti, Ce and Mg support wetting of Si substrate and thus assure the joint formation. Strength of joints was studied by shear test. The highest strength was achieved with S-Bond 220-1 solder. The strength of joints fabricated with S-bond solders on Si substrate varied from 23 to 38 MPa.

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Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

Cited by 4 publications

References 23 publications

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

Research of Soldering Silicon Substrate with Solder Type Sn-Ag-Ti

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