Study of bismuth sulphide films in Ni²⁺containing solution using electrochemical quartz crystal microbalance

EQCM study of electrochemical modification of Bi2S3 films in the Zn2+-containing electrolyte

“…When the bismuth sulfide film is reduced in the Zn 2+ -free background electrolyte, both at solution pH 3 and 5, the film mass under the potential region of negative current peak C1 decreases (df/dt and Df values increase). From our previous XPS analysis data [25], it was concluded that the bismuth sulfide film is reduced to Bi 0 and the decrease in the film mass under the potential region of cathodic peak C1 detected by EQCM is attributed to the detachment of S 2À ions from the electrode surface.…”

“…This technique has been widely used for investigation of electrochemical deposition of binary [28][29][30][31][32][33][34] or ternary chalkogenides [35][36][37]. In our previous publications [23][24][25] we used the bismuth sulfide film as an activator for direct Ni deposition. The reaction mechanism of electroreduction of bismuth sulfide film was investigated in both the nickel plating solution and supporting ones in more detail using EQCM [24,25].…”

“…In our previous publications [23][24][25] we used the bismuth sulfide film as an activator for direct Ni deposition. The reaction mechanism of electroreduction of bismuth sulfide film was investigated in both the nickel plating solution and supporting ones in more detail using EQCM [24,25]. The study of the reduction of bismuth sulfide coating in Watts nickel plating electrolyte shows that the observed increase in coating mass under the potential region close to the equilibrium potential of the Ni/Ni 2+ system is conditioned by Ni 2+ ions reduction before the bulk deposition of Ni, initiated by Bi 2 S 3 [24].…”

“…A metal-rich mixed sulfide Ni 3 Bi 2 S 2 -parkerite can be obtained when the modified bismuth sulfide film with the prebulk deposited nickel is annealed at temperatures higher than 120°C. The electrochemical reactions of Ni incorporation into the bismuth sulfide film depend on solution pH [25].…”

“…Bismuth sulfide films have also been proposed for direct metallization of dielectrics [13]. Successful direct metallization onto modified insulating polymer surfaces or electrically conductive substrates has been proposed using zinc sulfide [14], cobalt sulfide [15][16][17][18][19][20][21], nickel sulfide [22] and bismuth sulfide [23][24][25] as activators. Most commonly, an appropriate metal sulfide layer is deposited on a non-conductive surface using the successive ionic adsorption and reaction (SILAR) method.…”