2007
DOI: 10.1016/j.radmeas.2006.07.001
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Study of a new Lif:Mg,Cu,P formulation with enhanced thermal stability and a lower residual TL signal

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Cited by 13 publications
(9 citation statements)
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“…The relative height of the low-temperature peaks increases and the main peak, high-temperature peaks and residual signals are reduced with increasing Cu concentration in the range of 0.02e0.05 mol% and the sintering temperature (Tang et al, 1999). The height of the hightemperature peaks for HMCP is lower than that for GR-200A, and the low-temperature peaks for HMCP are higher than those for GR-200A (Tang et al, 2007). In order to achieve the purpose in this work, a higher sintering temperature and lower concentrations of Cu than those of HMCP should be used.…”
Section: Methodsmentioning
confidence: 89%
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“…The relative height of the low-temperature peaks increases and the main peak, high-temperature peaks and residual signals are reduced with increasing Cu concentration in the range of 0.02e0.05 mol% and the sintering temperature (Tang et al, 1999). The height of the hightemperature peaks for HMCP is lower than that for GR-200A, and the low-temperature peaks for HMCP are higher than those for GR-200A (Tang et al, 2007). In order to achieve the purpose in this work, a higher sintering temperature and lower concentrations of Cu than those of HMCP should be used.…”
Section: Methodsmentioning
confidence: 89%
“…Both TLD of LiF:Mg,Cu,Si and HMCP can be heated above 240 C (Lee et al, 2006;Tang et al, 2007Tang et al, , 2012. The shape of the HMCP glow curve shows minimal differences for annealing in the range from 250 to 270 C and the TL readout value remained stable (Tang et al, 2007). The shape of the glow curve of LiF:Mg,Cu,Si annealed between 260 C and 290 C shows minimal difference and the variation of TL response is within 5% (Tang et al, 2012).…”
Section: Introductionmentioning
confidence: 96%
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