Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS

Nakanishi, Hiroyuki; Nishimoto, Takahiro; Nakamura, Ryuta; Yotsumoto, Akira; Yoshida, Toshiomi; Shoji, Shuichi

doi:10.1016/s0924-4247(99)00246-0

Cited by 67 publications

(29 citation statements)

References 4 publications

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“…Quartz microchip is generally difficult to fabricate due to the requirement of high temperature (over 10007C) or high pressure in the bonding process [28][29][30]. We developed a multi-point pressure approach for quartz microchip bonding at normal temperature and no high-pressure equipment needed.…”

Section: Multi-point Pressure Bonding Approachmentioning

confidence: 99%

Integrated isotachophoretic preconcentration with zone electrophoresis separation on a quartz microchip for UV detection of flavonoids

Zhou

Wang

et al. 2006

Electrophoresis

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A quartz microchip integrated isotachophoretic (ITP) preconcentration with zone electrophoresis (ZE) separation was fabricated using a novel multi-point pressure method featured in normal temperature and lower pressure during bonding process. ITP followed by subsequential ZE of two flavonoids, quercetin and isorhamnetin on the microchip was performed consecutively on the homemade microfluidic workstation with UV detection, resulting in a decreased detectable concentration of 32-fold, compared to the ZE mode only, and their detection limits decreased down to 0.2 microg/mL and 1.2 microg/mL, respectively.

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Section: Multi-point Pressure Bonding Approachmentioning

confidence: 99%

Integrated isotachophoretic preconcentration with zone electrophoresis separation on a quartz microchip for UV detection of flavonoids

Zhou

Wang

et al. 2006

Electrophoresis

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“…One mm diameter holes for the reservoirs and wastes, which were also utilized as electrical contact points, were made on a cover plate (0.5 mm thick) by ultrasonic drilling. This cover plate was press-bonded for 24 h via 1% HF dipping [23]. Typical width and depth of the micro channel is 50 mm and 20 mm, respectively.…”

Section: Chip Fabricationmentioning

confidence: 99%

Low‐voltage electroosmosis pump for stand‐alone microfluidics devices

et al. 2003

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Two types of low-voltage electroosmosis pumps were developed using microfabrication technology for usage in handy or stand-alone applications of the micrototal analysis systems (micro-TAS) and the lab-on-a-chip. This was done by making a thin (< 1 microm) region in the flow path and by only applying voltages near this thin region using electrodes inserted into the flow path. The inserted electrodes must be free from bubble formation and be gas-tight in order to avoid pressure leakage. For these electrodes, Ag/AgCl or a gel salt bridge was used. For patterning the gel on the chip, a hydrophilic photopolymerization gel and a photolithographic technique were optimized for producing a gel with higher electric conductivity and higher mechanical strength. For high flow rate application, wide (33.2 mm) and thin (400 nm) pumping channels were compacted into a 1 mm x 6 mm area by folding. This pump achieves an 800 Pa static pressure and a flow of 415 nL/min at 10 V. For high-pressure application, a pump was designed with the thin and thick regions in series and positive and negative electrodes were inserted between them alternatively. This pump could increase the pumping pressure without increasing the supply voltage. A pump with 10-stage connections generated a pressure of 25 kPa at 10 V.

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“…• C) for inorganic materials bonding, such as plasma activation, 4-6 wet chemistry, 7 or combination of these processes. 8,9 Recently, silane coupling reagents have been widely used to enhance the adhesion between plasma-activated thermoplastics and PDMS hybrid microfluidic devices.…”

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confidence: 99%

Room-Temperature Direct Heterogeneous Bonding of Glass and Polystyrene Substrates

Wang

et al. 2018

J. Electrochem. Soc.

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Organic-inorganic hybrid structures enable new opportunities for ubiquitous sensors. Bonding of organic and inorganic materials is highly desirable but challenging. Polystyrene and glass are two of typical substrate materials for micro/nanofluidic devices. However, they are very difficult to be combined due to their extremely large thermal expansion mismatches. To avoid thermal stress generated at elevated temperatures, we developed a room-temperature direct bonding process between polystyrene and glass substrates using vacuum ultraviolet-ozone (VUV/O 3 ) surface irradiation without employing heat. After storage at room temperature (∼25 • C) for 24 h, the bonding strengths were measured to be >2 MPa, representing a robust interfacial bonding. The bonded polystyrene-glass pair exhibited excellent optical transparency due to nearly no deterioration at the bonding interface. The details of VUV/O 3 treated surfaces and bonding interfaces were characterized and a bonding model was demonstrated to elucidate the glass-polystyrene bonding mechanism.

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Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS

Cited by 67 publications

References 4 publications

Integrated isotachophoretic preconcentration with zone electrophoresis separation on a quartz microchip for UV detection of flavonoids

Integrated isotachophoretic preconcentration with zone electrophoresis separation on a quartz microchip for UV detection of flavonoids

Low‐voltage electroosmosis pump for stand‐alone microfluidics devices

Room-Temperature Direct Heterogeneous Bonding of Glass and Polystyrene Substrates

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