Studies on mechanical properties, dielectric behavior and DC conductivity of neodymium oxide/poly (butyl methacrylate) nanocomposites

Abstract

The current article aims to develop poly (butyl methacrylate) (PBMA) nanocomposites with enhanced electrical and mechanical properties by incorporating neodymium oxide (Nd2O3) nanoparticles between the PBMA chains. The morphological, thermal and structural profiles of the PBMA nanocomposites reinforced with different loading of Nd2O3 nanoparticles were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD) and thermogravimetric analysis (TGA). The SEM images revealed that the morphology of the PBMA was significantly influenced by the insertion of Nd2O3. The uniform dispersion of Nd2O3 in the polymer composite was visible at 5 wt% loading of nano-filler. The main crystalline peaks of Nd2O3 nanoparticles in the amorphous PBMA structure were revealed by the X-ray diffraction analysis. The thermal stability of PBMA was greatly enhanced by the dispersion of Nd2O3 in the PBMA matrix. The tensile strength and elongation at break of the composites were measured and both results showed the enhanced mechanical properties of PBMA due to the reinforcement of Nd2O3 nanoparticles. The various parameters affecting the increased tensile strength of composite by the incorporation of nanoparticles were studied by different theoretical modeling. The electrical properties such as dielectric constant and the dielectric loss tangent (tan δ) of PBMA nanocomposites were enhanced with the addition of nanoparticles. Also, the DC conductivity of polymer composites was estimated and the applicability of different theoretical models for predicting the conductivity properties of PBMA/Nd2O3 nanocomposites were examined.

Effect of Cu-Al2O3nanoparticles on the performance of chlorinated polyethylene nanocomposites

“…The tensile strength of material is diminished as a result of the nanoparticles failure to uniformly transmit stress from the polymer matrix. 32 The elongation at break is observed to be slightly reduced by the inclusion of nanoparticles, as shown in Table 1. This is due to the increased stiffness of the CPE nanocomposites.…”

Preferential localization of conductive filler in ethylene‐co‐methyl acrylate/thermoplastic polyolefin polymer blends to reduce percolation threshold and enhanced electromagnetic radiation shielding over K band region

“…The blend of these polymers shows 466°C as degradation temperature. With the increasing filler content in the neat blend, T max is also increasing; it is reported that composite with the 30 wt% shows the 479.14°C degradation temperature, [ 52 ] thus the enhancement in thermal stability of the composite is because of the polymer and VCB filler interaction which restrict the diffusion the volatile component.…”

Design and Evaluation of a Cyanate Ester Containing Oxaspirocyclic Structure for Electronic Packaging

“…Figure 5(b) displays the variation of dielectric loss with frequencies for PCBDCy and BADCy. Dielectric loss is the function of the relaxation process which depends on the change in the viscoelastic nature of the polymer [30,31]. In the structure of PCBDCy, oxaspirocyclic segments decreased the crosslinking density, endowing the molecules with more flexibility and deformability, thus the activity of the chain segment increases, and the orientation of polar groups is less constrained by the chain segment, leading to 8…”