Studies of nanostructured copper/hydrogenated amorphous carbon multilayer films

Dwivedi, Neeraj; Kumar, Sushil; Ishpal,; Dayal, Saurabh; Govind,; Rauthan, C. M. S.; Panwar, O. S.

doi:10.1016/j.jallcom.2010.10.016

Cited by 53 publications

(29 citation statements)

References 35 publications

(35 reference statements)

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“…Over the last decade, there has been a specific interest in the formation of copper-carbon nanocomposite films as wear resistant and low friction coatings for tribological applications [10][11][12][13][14][15]. Furthermore, the incorporation of copper has been reported to reduce the temperature-dependent electrical transport and also to enhance the absorbance of light which could be useful for some photovoltaic applications [13].…”

Section: Introductionmentioning

confidence: 99%

Effect of the metal concentration on the structural, mechanical and tribological properties of self-organized a-C:Cu hard nanocomposite coatings

Pardo

Buijnsters

Endrino

et al. 2013

Applied Surface Science

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174 GPa for the film with a Cu content of 28 at.%. In parallel, a 50% drop in the nanohardness from about 28 GPa towards 14 GPa is observed for these coatings. An increase in the Cu content also produces an increment of the coefficient of friction in reciprocating sliding tests performed against a corundum ball counterbody. As compared to the metal free film, a nearly four times higher coefficient of friction value is detected in the case of a Cu content of 28 at.%. Nevertheless, the carbon-copper composite coatings produced a clear surface protection of the substrate evidenced by a reduced wear loss for Cu contents below 5 at.%.

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Section: Introductionmentioning

confidence: 99%

Effect of the metal concentration on the structural, mechanical and tribological properties of self-organized a-C:Cu hard nanocomposite coatings

Pardo

Buijnsters

Endrino

et al. 2013

Applied Surface Science

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“…The residual stress in these Cu/DLC bilayer films deposited on silicon wafer were determined from the change in the radius of curvature of the wafer, before and after deposition, using 500TC temperature controlled film stress measurement system (M/s FSM Frontier Semiconductor, USA). Stoney formula was used to evaluate residual stress and is given by the following equation: [2,20] …”

Section: Methodsmentioning

confidence: 99%

“…Observed AFM pictures clearly reveal the nanostructured morphology in which particles are uniformly distributed over entire surface. Recently, we observed nanostructured morphology by employing Cu/a-C : H multilayer structure [20]. The size of particles in Cu/DLC bilayer films was found to increase with increasing self bias.…”

Section: Atomic Force Microscopy (Afm) Analysismentioning

confidence: 99%

“…Due to difficulty in preparation of diamond in the laboratories, the diamond-like carbon (DLC) thin films, which exhibit properties similar to that of diamond such as high hardness, high transmission, and higher thermal conductivity, have attracted considerable attention of researchers across the world [1][2][3][4][5][6][7]. Recently, DLC film has also been undertaken to explore its distinguishable electronic properties, which results in its applications in the development of solar cells, field emission devices, and microelectromechanical systems (MEMS) [8][9][10][11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

“…Recently, we have also prepared nanostructured Cu/a-C : H multilayer structure [20] using the same hybrid system. Various structural and mechanical properties such as surface morphology, mean roughness (R a ), residual stress (σ), hardness (H), elastic modulus (E), and various other mechanical parameters such as plastic resistance parameter (H/E), elastic recovery (ER), ratio of residual displacement after load removal with displacement at maximum load (h res /h max ), plastic deformation energy (U r ), contact stiffness (S max ), hardness per unit stress (H/σ), and plastic resistance parameter per unit stress [(H/E)/σ] were estimated in Cu/DLC bilayer films.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Role of Sandwich Cu Layer in and Effect of Self-Bias on Nanomechanical Properties of Copper/Diamond-Like Carbon Bilayer Films

Dwivedi

Kumar

Malik

et al. 2011

ISRN Nanotechnology

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The role of sandwich Cu layer in and effect of self-bias on structural and nanomechanical properties of Cu/DLC bilayer films have been explored. Cu/DLC bilayer films were grown, under varied self-bias from −125 to −225 V, using hybrid system involving radiofrequency-(RF-) plasma-enhanced chemical vapor deposition and RF-sputtering units. Surface topography and mean roughness was studied by atomic force microscope and then correlated with mechanical properties. The addition of sandwich Cu layer in DLC reduces its residual stress and does not affect bilayer film hardness and elastic modulus. Load versus displacement was also employed to estimate various other mechanical parameters, which further correlated with self-bias and structural properties. These Cu/DLC bilayer films seem to be a potential candidate for various industrial applications such as hard and protective coating on cutting tools, solar cells, and wear resistance coating on magnetic storage media.

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Cost Effective Deposition System for Nitrogen Incorporated Diamond‐like Carbon Coatings

Kumar

Dwivedi

Dalai

2012

Plasma Processes & Polymers

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Nitrogen incorporated diamond-like carbon (N-DLC) thin films were grown, at high base pressure of 5 Â 10 À3 Torr, under varied nitrogen gas pressure (NGP) (variation from 55 to 85 mTorr) and varied negative self-bias (NSB) (variation from 35 to 190 V), using primary pump (rotary pump) processed radio frequency-plasma enhanced chemical vapour deposition technique. These films then studied for their structural compositional and nanomechanical properties. Time of flight-secondary ion mass spectroscopy was used to confirm the presence of nitrogen and to investigate the depth profile of these N-DLC films, whereas energy dispersive X-ray analysis measurement was carried to analyze the atomic concentration of constituents of film. Micro-Raman analysis reveals change in D and G peak positions and I D /I G ratio with the change in NSB as well as NGP. It is worth noting that N-DLC film grown at NGP and NSB of 55 mTorr and 100 V, respectively, exhibited very high hardness as 40.3 GPa. Hence, due to better nanomechanical properties by simpler, high deposition rate and cost effective process, which yielded very high throughput may leads these N-DLC films to their wide industrial applications such as hard and protective coating on cutting tools, automobile parts, bio-implants or wear resistant coating on magnetic hard disk.

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Studies of nanostructured copper/hydrogenated amorphous carbon multilayer films

Cited by 53 publications

References 35 publications

Effect of the metal concentration on the structural, mechanical and tribological properties of self-organized a-C:Cu hard nanocomposite coatings

Effect of the metal concentration on the structural, mechanical and tribological properties of self-organized a-C:Cu hard nanocomposite coatings

Role of Sandwich Cu Layer in and Effect of Self-Bias on Nanomechanical Properties of Copper/Diamond-Like Carbon Bilayer Films

Cost Effective Deposition System for Nitrogen Incorporated Diamond‐like Carbon Coatings

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