Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Drost, A.; Klink, G.; Feil, Michael; Bock, Karlheinz

doi:10.1109/isapm.2005.1432062

Cited by 6 publications

(7 citation statements)

References 1 publication

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“…In this section, we describe the implementation of some of the microfabrication processes such as sputtering, lithography, etching and electroplating to manufacture the wiring lines on plastic film rolls that act as interconnection layers for film based flexible electronics. Here, we present only an overview about the aforementioned process steps and comprehensive information about these processes can be found at [42].…”

Section: Microfabrication Technologies For R2r Processingmentioning

confidence: 99%

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Palavesam

Marı́n

Hemmetzberger

et al. 2018

Flex. Print. Electron.

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Roll-to-roll (R2R) processing on film substrates has been demonstrated to have the potential for achieving high throughput manufacturing of organic electronic systems at low cost. However, the ever-growing mobile devices market accompanied by the developments in information and communication technologies require high performance systems at very low power operation, sometimes on larger substrates having sizes in the range of a few metres. Organic electronics often fall short of fulfilling the required computing performance and power requirements of most of the common use cases. Hybrid integration of inorganic monocrystalline silicon chips on polymer films is a means to fulfil the aforementioned requirements. In this context, it is opportune to report our recent activities on R2R processing of plastic films for hybrid integration of flexible electronics. Hybrid integration can be performed with conventional, rigid surface mount devices as well as flexible, ultrathin bare silicon chips. The first section of the paper is dedicated to a brief overview of R2R manufacturing of electronic devices with an example of production of radio frequency identification tags as well as to a discussion emphasising the targets for hybrid integration. Then, detailed descriptions about our processes for R2R manufacturing of metal wiring lines on films and hybrid integration are included. Three-dimensional integration of films and a temperature sensor label manufactured using hybrid integration process are also elaborated on. Furthermore, key results from fatigue reliability assessment of R2R metallised wiring lines are reported. Finally, some of the challenges in transferring the R2R processes for hybrid integration on film substrates from research labs to industrial manufacturing are highlighted.

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Section: Microfabrication Technologies For R2r Processingmentioning

confidence: 99%

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Palavesam

Marı́n

Hemmetzberger

et al. 2018

Flex. Print. Electron.

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“…Processing speed depends on the thickness of the layer to be etched and retention time in the etch bath. In general, wet etching is a relatively slow process and often constitutes the time-determining step in the process flow [2,3]. Figure 1 shows an interdigitated capacitor with lines and spaces of 15 ptm width.…”

Section: Motivationmentioning

confidence: 99%

“…If greater structure heights are required, conducting lines can be electroplated. Electroplating can also be achieved in a roll-toroll format [2]. Figure 2 shows copper lines of 20 ptm width that were electroplated to a thickness of approximately 7 ptm, starting from a photolithographically structured 500 nm thick Cu layer on polyimide foil.…”

Section: Motivationmentioning

confidence: 99%

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Large Area Cost-Efficient Electronics Systems Integration

Bock

Klink

Strohhöfer

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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Polymer electronic is expected to be a promising technology for low-cost and large-area electronic systems to support information and communication technology, sensor networks, life sciences, medical and bio-sensing devices, which can not easily be addressed by traditional chip technology.Solutions of polymer or polymer based pastes offer advantages due to their easy processing possibilities which give the opportunity to coat and pattern them like a printing ink. Hence reel-to-reel manufacturing with endless substrates of foil is a key technology to fulfil the challenging cost demands of cheap flexible systems.However printing resolution and registration as well as the electrical performance of polymer materials request at present still a hybrid approach based on most-polymer materials and partially-printed technologies to reach reasonable performance of systems. The process integration presented is based on a photolithographic process for the first level based on metallized foils, which is used to pattern the first interconnect and electrode layer with low resistance and high resolution compared to printing. With two subsequent lacquering and three screen printing steps for example polymer field effect transistors as well as sensors and actuators are integrated to circuits.Moreover this approach enables the possibility to use such functional flexible foil substrates for the hetero-integration of cost-efficient systems merging thin silicon chips with further thin, flexible or printed electronic components, sensors actuators batteries displays and even micro-fluidics andpneumatics on a foil substrate. This paper prevents an overview over the hybride heterointegration approach for flexible electronic foil systems so-called polytronics developed at Fraunhofer IZM [1,2].

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“…In the meanwhile publications show progress in the fabrication of polymer electronic circuits for low cost applications [13,14,24,25]. However a completely reliable in-line lowcost fabrication process of polymer electronics circuitry has not been proven so far in an application and therefore needed still further efforts to be paid up to now.…”

Section: Status Of Polymer Electronicsmentioning

confidence: 99%

Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems?

Bock

2005

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Current trends in the development of electronics systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At present, this world is very much dominated by inorganic active materials, in particular thin flexible silicon integrated circuits, but new functionality based on conductive and semi-conductive plastic materials is developing fast. Freedom of design, compact portable products, cost-effective production and assembly, environment friendly materials, software based printed ICs,, flexible polymer transistors and thin flexible silicon ICS-there are unquestionable advantages of flexible electronics. Microsystems incorporating fluidic, mechanical, optical and electrical components are under research and development at present. A new word,

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Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems

Cited by 6 publications

References 1 publication

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Large Area Cost-Efficient Electronics Systems Integration

Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems?

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