Studies of cure schedule and final property relationships of a commercial epoxy resin using modified imidazole curing agents

Barton, John M.; Hamerton, Ian; Howlin, Brendan J.; Jones, John R.; Liu, Shuyuan

doi:10.1016/s0032-3861(97)00372-8

Cited by 95 publications

(62 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…The present work aims at studying in detail the kinetics of the copolymerization of a DGEBA epoxy resin with a spiranic bislactone, 1,6-dioxaspiro [4,4]nonan-2,7-dione (s(gBL)), and test the efficiency of several anionic initiators which are already used for the homopolymerization of DGEBA and other epoxy resins [15][16][17][18][19] and the copolymerization of epoxides with cyclic carbonates, [20][21][22] namely 1-methylimidazole (1MI), 4-(N,N-dimethyl)aminopyridine (DMAP) and 1,5-diazabicyclo[4.3.0]non-5-ene (DBN). Scheme 2 depicts the structures of these initiators.…”

Section: Introductionmentioning

confidence: 99%

Crosslinking of mixtures of DGEBA with 1,6‐dioxaspiro[4,4]nonan‐2,7‐dione initiated by tertiary amines. I. Study of the reaction and kinetic analysis

Fernández‐Francos

Salla

Mantecón

et al. 2008

J of Applied Polymer Sci

View full text Add to dashboard Cite

ABSTRACT:The anionic copolymerization of a Diglycidyl ether of bisphenol A (DGEBA) epoxy resin and a bislactone has been studied with different initiators. The kinetics of the process has been dealt with in detail, and it has been detected the existence of different competing curing mechanisms: a quasi-alternating copolymerization between the epoxy monomer and the bislactone, and homopolymerization of the epoxy resin. In presence of an excess of DGEBA, the copolymerization first takes place, and then the excess of epoxy monomer can homopolymerize. The bislactone induces an apparent accelerating effect because it reduces the extent of epoxy homopolymerization and therefore the termination reactions associated with it, thus allowing a complete cure with a reduced amount of initiator.

show abstract

Section: Introductionmentioning

confidence: 99%

Crosslinking of mixtures of DGEBA with 1,6‐dioxaspiro[4,4]nonan‐2,7‐dione initiated by tertiary amines. I. Study of the reaction and kinetic analysis

Fernández‐Francos

Salla

Mantecón

et al. 2008

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…Therefore, considerable attention has been paid to the curing reaction, thermal and mechanical properties of epoxy resins. [1][2][3][4][5][6][7][8][9][10][11][12][13][14] However, the main research works were focused on the systems based on bifunctional epoxy resins [1][2][3][4][5][6][7][8][9][10] and tetrafunctional epoxy resins, [10][11][12][13][14] with various curing agents; few efforts was made on those involving multifunctional novolac epoxy resins.…”

Section: Introductionmentioning

confidence: 99%

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Liu

Zhang

et al. 2006

J of Applied Polymer Sci

View full text Add to dashboard Cite

ABSTRACT:The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fouriertransform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn-Wall-Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of À ÀOH, À ÀCH 2 À À, À ÀCH 3 , OCÀ ÀO and CÀ ÀOÀ ÀC, etc., taking place between 300 and 4508C; and the carbonizing or oxidating of aromatic rings occurring above 4508C. The kinetics of the degradation reaction was studied with Coats-Redfern method showing a first-order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER ¼ 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T g and a slight lower degradation temperature than the undiluted system.

show abstract

“…4 The importance mainly arises from the intrinsic high performance of the corresponding cured materials, that is, excellent thermal stability, high chemical resistance, and good adhesion to various materials. [5][6][7][8] Recent unprecedented progress in the adhesive-based production of electronic devices has accelerated the increase in demands for improvements in the performance of the epoxy-imidazole system.For the effective modification of epoxy curing systems, the addition of other monomers that can undergo copolymerization with epoxy monomers is a hopeful approach because it can give us the opportunity to control the reactivity of a specific system by the proper molecular design of a comonomer and by the setting of a proper feed ratio between the epoxy monomer and the comonomer. Another advantage of such a well-designed copolymerization is that the corresponding main-chain structure can become totally different from that of the epoxy homopolymer, and this can result in drastic changes in the physical properties.…”

mentioning

confidence: 99%

Imidazole‐promoted copolymerization of epoxide and 3,4‐dihydrocoumarin and its application to a high‐performance curing system

Sudo

Uenishi

Endō

2007

J. Polym. Sci. A Polym. Chem.

View full text Add to dashboard Cite

The imidazole-promoted curing reaction of epoxide has increased its importance in various application fields, such as the bonding of electrodevices, 1 coatings, 2 structural adhesion, 3 and the fabrication of nanocomposite materials. 4 The importance mainly arises from the intrinsic high performance of the corresponding cured materials, that is, excellent thermal stability, high chemical resistance, and good adhesion to various materials. [5][6][7][8] Recent unprecedented progress in the adhesive-based production of electronic devices has accelerated the increase in demands for improvements in the performance of the epoxy-imidazole system.For the effective modification of epoxy curing systems, the addition of other monomers that can undergo copolymerization with epoxy monomers is a hopeful approach because it can give us the opportunity to control the reactivity of a specific system by the proper molecular design of a comonomer and by the setting of a proper feed ratio between the epoxy monomer and the comonomer. Another advantage of such a well-designed copolymerization is that the corresponding main-chain structure can become totally different from that of the epoxy homopolymer, and this can result in drastic changes in the physical properties. Herein we report a new method to improve the performance characteristics of the epoxy-imidazole curing system, such as the curing shrinkage, glass transition temperature (T g ), and adhesion strength. The method relies on a newly developed copolymerization of epoxide and a six-membered aromatic lactone, 3,4-dihydrocoumarin (DHCM). As far as we know, DHCM has been not examined as a comonomer for epoxide, whereas some aliphatic lactones have been claimed to be effective for controlling the curing rate of epoxy resins.

show abstract

Studies of cure schedule and final property relationships of a commercial epoxy resin using modified imidazole curing agents

Cited by 95 publications

References 13 publications

Crosslinking of mixtures of DGEBA with 1,6‐dioxaspiro[4,4]nonan‐2,7‐dione initiated by tertiary amines. I. Study of the reaction and kinetic analysis

Crosslinking of mixtures of DGEBA with 1,6‐dioxaspiro[4,4]nonan‐2,7‐dione initiated by tertiary amines. I. Study of the reaction and kinetic analysis

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Imidazole‐promoted copolymerization of epoxide and 3,4‐dihydrocoumarin and its application to a high‐performance curing system

Contact Info

Product

Resources

About